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PowerHerd: dynamic satisfaction of peak power constraints in interconnection networks
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Source International Conference on Supercomputing archive
Proceedings of the 17th annual international conference on Supercomputing table of contents
San Francisco, CA, USA
SESSION: Power table of contents
Pages: 98 - 108  
Year of Publication: 2003
ISBN:1-58113-733-8
Authors
Li Shang  Princeton University, Princeton, NJ
Li-Shiuan Peh  Princeton University, Princeton, NJ
Niraj K. Jha  Princeton University, Princeton, NJ
Sponsors
ACM: Association for Computing Machinery
SIGARCH: ACM Special Interest Group on Computer Architecture
Publisher
ACM  New York, NY, USA
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ABSTRACT

Power consumption is a critical issue in interconnection network design, driven by power- related design constraints, such as thermal and power delivery design. Usually, off-line worst-case power analysis is used in network design to guarantee safe on-line operation, which not only increases system cost but also constrains network performance. In this work, we present an on-line mechanism, called PowerHerd, which can dynamically regulate network power consumption, and guarantee that network peak power constraints are not exceeded. PowerHerd is a distributed approach -- within the interconnection network, each router dynamically maintains a local power budget, controls its local power dissipation, and exchanges spare power resources with its neighboring routers to optimize network performance.Experiments demonstrate that PowerHerd can effectively regulate network power consumption meeting peak power constraints with negligible network performance penalty. Armed with PowerHerd, network designers can focus on system performance and power optimization for the average case rather than the worst case, thus making it possible to employ a more powerful interconnection network in the system.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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L.-T. Yeh and R. C. Chu. Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods, and Design Practices. ASME Press, New York, NY, 2002.


Collaborative Colleagues:
Li Shang: colleagues
Li-Shiuan Peh: colleagues
Niraj K. Jha: colleagues