| Exploring power management in multi-core systems |
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Asia and South Pacific Design Automation Conference
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Proceedings of the 2008 Asia and South Pacific Design Automation Conference
table of contents
Seoul, Korea
SESSION: Reliability and power management
table of contents
Pages: 708-713
Year of Publication: 2008
ISBN:978-1-4244-1922-7
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Authors
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Reinaldo Bergamaschi
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IBM T. J. Watson Research Center, Yorktown Heights, NY
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Guoling Han
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University of California, Los Angeles, CA
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Alper Buyuktosunoglu
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IBM T. J. Watson Research Center, Yorktown Heights, NY
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Hiren Patel
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Virginia Tech, Blacksburg, VA
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Indira Nair
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IBM T. J. Watson Research Center, Yorktown Heights, NY
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Gero Dittmann
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IBM T. J. Watson Research Center, Yorktown Heights, NY
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Geert Janssen
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IBM T. J. Watson Research Center, Yorktown Heights, NY
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Nagu Dhanwada
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IBM STG, East Fishkill, NY
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Zhigang Hu
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IBM T. J. Watson Research Center, Yorktown Heights, NY
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Pradip Bose
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IBM T. J. Watson Research Center, Yorktown Heights, NY
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John Darringer
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IBM T. J. Watson Research Center, Yorktown Heights, NY
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IEEE Computer Society Press
Los Alamitos, CA, USA
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ABSTRACT
Power dissipation has become a critical design metric in microprocessor-based system design. In a multi-core system, running multiple applications, power and performance can be dynamically traded off using an integrated power management (PM) unit. This PM unit monitors the performance and power of each core and dynamically adjusts the individual voltages and frequencies in order to maximize system performance under a given power budget (usually set by the operating system). This paper presents a performance and power analysis methodology, featuring a simulation model for multi-core systems that can be easily reconfigured for different scenarios and a PM infrastructure for the exploration and analysis of PM algorithms. Two algorithms have been implemented: one for discrete and one for continuous power modes based on non-linear programming. Extensive experiments are reported, illustrating the effect of power management both at the core and the chip level.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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