Compact thermal modeling for temperature-aware design

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Compact thermal modeling for temperature-aware design

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Annual ACM IEEE Design Automation Conference archive
Proceedings of the 41st annual Design Automation Conference table of contents

San Diego, CA, USA

SESSION: Energy and thermal-aware design table of contents

Pages: 878 - 883

Year of Publication: 2004

ISBN:1-58113-828-8

Authors

Wei Huang	University of Virginia, Charlottesville, VA
Mircea R. Stan	University of Virginia, Charlottesville, VA
Kevin Skadron	University of Virginia, Charlottesville, VA
Karthik Sankaranarayanan	University of Virginia, Charlottesville, VA
Shougata Ghosh	University of Virginia, Charlottesville, VA
Sivakumar Velusam	University of Virginia, Charlottesville, VA

Sponsors

ACM: Association for Computing Machinery
SIGDA: ACM Special Interest Group on Design Automation

Publisher

ACM New York, NY, USA

Bibliometrics

Downloads (6 Weeks): 27, Downloads (12 Months): 152, Citation Count: 43

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abstract references cited by index terms collaborative colleagues

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ABSTRACT

Thermal design in sub-100nm technologies is one of the major challenges to the CAD community. In this paper, we first introduce the idea of temperature-aware design. We then propose a compact thermal model which can be integrated with modern CAD tools to achieve a temperature-aware design methodology. Finally, we use the compact thermal model in a case study of microprocessor design to show the importance of using temperature as a guideline for the design. Results from our thermal model show that a temperature-aware design approach can provide more accurate estimations, and therefore better decisions and faster design convergence.

REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

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	N. Venkateswaran , S. Balaji , V. Sridhar, Fault tolerant bus architecture for deep submicron based processors, ACM SIGARCH Computer Architecture News, v.33 n.1, March 2005
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