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Tradeoffs between date oxide leakage and delay for dual Tox circuits
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 41st annual Design Automation Conference table of contents
San Diego, CA, USA
SESSION: Leakage power optimization table of contents
Pages: 761 - 766  
Year of Publication: 2004
ISBN:1-58113-828-8
Authors
Anup Kumar Sultania  University of Minnesota, Minneapolis, MN
Dennis Sylvester  University of Michigan, Ann Arbor, MI
Sachin S. Sapatnekar  University of Minnesota, Minneapolis, MN
Sponsors
ACM: Association for Computing Machinery
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 3,   Downloads (12 Months): 14,   Citation Count: 8
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ABSTRACT

Gate oxide tunneling current (Igate) will become the dominant component of leakage in CMOS circuits as the physical oxide thickness (Tox) goes below 15AA. Increasing the value of Tox reduces the leakage at the expense of an increase in delay, and a practical tradeoff between delay and leakage can be achieved by assigning one of the two permissible Tox values to each transistor. In this paper, we propose an algorithm for dual Tox assignment to optimize the total leakage power under delay constraints, and generate a leakage/delay tradeoff curve. As compared to the case where all transistors are set to low Tox, our approach achieves an average leakage reduction of 83% under 100nm models.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
Semiconductor Industry Association, "International Technology Roadmap for Semiconductors," 2002. Available at http://public.itrs.net.
2
3
4
 
5
Y. Oowaki et al., "A sub-0.1 $\mu m$ Circuit Design with Substrate-Over-Biasing," in IEEE ISSCC Dig. of Tech. Papers, pp. 88--89, Feb. 1998.
 
6
S. Narendra et al., "Leakage Issues in IC design: Trends, Estimation, and Avoidance." Tutorial at the IEEE/ACM ICCAD, Nov. 2003.
7
 
8
C.-H. Choi et al., "Impact of Gate Direct Tunneling on Circuit Performace: A Simulation Study," IEEE Trans. on Electron Devices, pp. 2823--2829, Dec. 2001.
 
9
 
10
K. Bernstein, Private Communication. IBM T. J. Watson Research Center, Yorktown Heights, NY, 2003.
 
11
Y. Taur, "CMOS Design Near the Limits of Scaling," IBM J. R&D, vol. 46(2/3), pp. 213--222, Mar./May 2002.
 
12
K. Chen et al., "Predicting CMOS Speed with Gate Oxide and Voltage Scaling and Interconnect Loading Effects," IEEE Trans. On Electron Devices, vol. 44(11), pp. 1951--1957, Nov. 1997.
 
13
Device Group at UC Berkeley, "Berkeley Predictive Technology Model," 2002. Available at http://www-device.eecs.berkeley.edu/ptm/.
 
14
 
15
 
16
K. A. Bowman et al., "A Circuit-Level Perspective of the Optimum Gate Oxide Thickness," IEEE Trans. on Electron Devices, vol. 48(8), pp. 1800--1810, Aug. 2001.
 
17
J. Fishburn and A. Dunlop, "TILOS: A Posynomial Programming Approach to Transistor Sizing," in Proc. of ACM/IEEE ICCAD, pp. 326--328, Nov. 1985.
 
18
E. M. Sentovich et al., "SIS: A System for Sequential Circuit Synthesis," Tech. Rep. UCB/ERL M92/41, Electronics Research Laboratory, Dept. of EECS, University of California, Berkeley, May 1992.

CITED BY  8

Collaborative Colleagues:
Anup Kumar Sultania: colleagues
Dennis Sylvester: colleagues
Sachin S. Sapatnekar: colleagues