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Variational delay metrics for interconnect timing analysis
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 41st annual Design Automation Conference table of contents
San Diego, CA, USA
SESSION: Model order reduction and variational techniques for parasitic analysis table of contents
Pages: 381 - 384  
Year of Publication: 2004
ISBN:1-58113-828-8
Authors
Kanak Agarwal  University of Michigan, Ann Arbor, MI
Dennis Sylvester  University of Michigan, Ann Arbor, MI
David Blaauw  University of Michigan, Ann Arbor, MI
Frank Liu  IBM Research, Austin, TX
Sani Nassif  IBM Research, Austin, TX
Sarma Vrudhula  University of Arizona, Tucson, AZ
Sponsors
ACM: Association for Computing Machinery
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 8,   Downloads (12 Months): 42,   Citation Count: 29
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ABSTRACT

In this paper we develop an approach to model interconnect delay under process variability for timing analysis and physical design optimization. The technique allows for closed-form computation of interconnect delay probability density functions (PDFs) given variations in relevant process parameters such as linewidth, metal thickness, and dielectric thickness. We express the resistance and capacitance of a line as a linear function of random variables and then use these to compute circuit moments. Finally, these variability-aware moments are used in known closed-form delay metrics to compute interconnect delay PDFs. We compare the approach to SPICE based Monte Carlo simulations and report an error in mean and standard deviation of delay of 1% and 4% on average, respectively.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
S. R. Nassif, "Modeling and Analysis of Manufacturing Variations," CICC, pp. 223--228, 2001.
 
2
Z. Lin, C. Spanos, L. Milor, and Y. Lin, "Circuit Sensitivity to Interconnect Variation," IEEE Trans. on Semiconductor Manufacturing, v. 11, pp. 557--568, Nov. 1998.
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W.C. Elmore, "The transient response of damped linear networks with particular regard to wideband amplifiers," J. Applied Physics, v. 19, pp. 55--63, Jan. 1948.
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V. Mehrotra, S. Nassif, D. Boning, and J. Chung, "Modeling the Effects of Manufacturing Variation on High-Speed Microprocessor Interconnect Performance," IEEE Electron Devices Meetings, pp. 767--770, 1998.
 
13
J. Chern, J. Huang, L. Arledge, P. Li, and P. Yang, "Multilevel Metal Capacitance Models for CAD Design Synthesis Systems," IEEE Electron Devices Letters, pp. 32--34, Jan. 1992.

CITED BY  29

Collaborative Colleagues:
Kanak Agarwal: colleagues
Dennis Sylvester: colleagues
David Blaauw: colleagues
Frank Liu: colleagues
Sani Nassif: colleagues
Sarma Vrudhula: colleagues