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ABSTRACT
As technology advances into the nanometer territory, the antenna problem has caused significant impact on routing tools. The antenna effect is a phenomenon of plasma-induced gate oxide degradation caused by charge accumulation on conductors. It directly influences manufacturability and yield of VLSI circuits, especially in deep-submicron technology using high density plasma. Furthermore, the continuous increase of the problem size of IC routing is also a great challenge to existing routing algorithms. In this paper, we propose a novel framework for multilevel full-chip routing with antenna avoidance using a built-in jumper insertion approach. Experimental results show that our approach reduced antenna-violated gates by about 98% and also achieved 100% routing completion for all circuits.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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[doi> 10.1145/266021.266123]
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CITED BY 11
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Hailong Yao , Yici Cai , Xianlong Hong , Qiang Zhou, Improved multilevel routing with redundant via placement for yield and reliability, Proceedings of the 15th ACM Great Lakes symposium on VLSI, April 17-19, 2005, Chicago, Illinois, USA
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Tsung-Yi Ho , Chen-Feng Chang , Yao-Wen Chang , Sao-Jie Chen, Multilevel full-chip routing for the X-based architecture, Proceedings of the 42nd annual conference on Design automation, June 13-17, 2005, San Diego, California, USA
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