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Prediction of interconnect adjacency distribution: derivation, validation, and applications
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Source International Workshop on System-Level Interconnect Prediction archive
Proceedings of the 2004 international workshop on System level interconnect prediction table of contents
Paris, France
SESSION: Statistical interconnect prediction table of contents
Pages: 99 - 106  
Year of Publication: 2004
ISBN:1-58113-818-0
Authors
Payman Zarkesh-Ha  LSI Logic Corporation, Milpitas, CA
Ken Doniger  LSI Logic Corporation, Milpitas, CA
William Loh  LSI Logic Corporation, Milpitas, CA
Peter Bendix  LSI Logic Corporation, Milpitas, CA
Sponsors
ACM: Association for Computing Machinery
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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ABSTRACT

An analytical interconnect adjacency distribution model for random logic interconnect networks based on the Bernoulli probability distribution is derived. By definition, interconnect adjacency is the fractional length of an interconnect for which there is a neighboring interconnect at minimum spacing. Some possible applications of the interconnect adjacency distribution are statistical cross-talk analysis, interconnect yield prediction, and statistical interconnect reference circuit for more realistic capacitance estimation.The model uses only simple and readily available system parameters well known to designers. These are the wire-length distribution and the average channel utilization. Comparison to product data shows good agreement with the model.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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W. E. Donath, "Statistical properties of the placement of a graph," SIAM Journal of Applied Mathematics, vol. 16, pp. 439--457, 1968.
 
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J. A. Davis, V. K. De and J. D. Meindl, "A stochastic wire-length distribution for gigascale integration (GSI): Part I: Derivation and validation," IEEE Transaction on Electron Devices, vol. 45, No. 3, pp. 580--589, March 1998.
 
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Collaborative Colleagues:
Payman Zarkesh-Ha: colleagues
Ken Doniger: colleagues
William Loh: colleagues
Peter Bendix: colleagues