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A low power approach to system level pipelined interconnect design
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Source International Workshop on System-Level Interconnect Prediction archive
Proceedings of the 2004 international workshop on System level interconnect prediction table of contents
Paris, France
SESSION: Interconnect design and optimization table of contents
Pages: 45 - 52  
Year of Publication: 2004
ISBN:1-58113-818-0
Authors
Vikas Chandra  Carnegie Mellon University, Pittsburgh, PA
Anthony Xu  Carnegie Mellon University, Pittsburgh, PA
Herman Schmit  Carnegie Mellon University, Pittsburgh, PA
Sponsors
ACM: Association for Computing Machinery
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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ABSTRACT

System on Chip interconnects require first-in first-out buffers (FIFOs) to handle different data rates between IP cores. The design of an interconnect channel containing multiple stages of FIFO require making tradeoff between throughput and power consumption. The design variables are the sizes of the FIFOs, their voltages and their clock frequencies. Decreasing the FIFO clock frequencies saves power but it causes the channel performance (throughput) to decrease. In this work, we recover the performance by resizing the FIFOs in the channel. The voltage and clock scaling in the interconnect channel followed by FIFO resizing approach leads to significant power savings. The power savings is a function of system parameters λ (expected data production rate) and μ (expected data consumption rate). We observed a maximum dynamic power savings of 45.8%, 28.9% and 11.3% for min(λ, μ) of 0.2, 0.5 and 0.8 respectively. Our approach of reducing voltage in the interconnect channel will reduce the leakage power as well.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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Collaborative Colleagues:
Vikas Chandra: colleagues
Anthony Xu: colleagues
Herman Schmit: colleagues