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Microarchitecture level power and thermal simulation considering temperature dependent leakage model
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Source International Symposium on Low Power Electronics and Design archive
Proceedings of the 2003 international symposium on Low power electronics and design table of contents
Seoul, Korea
SESSION: Temperature and power aware architectures table of contents
Pages: 211 - 216  
Year of Publication: 2003
ISBN:1-58113-682-X
Authors
Weiping Liao  University of California at Los Angeles, Los Angeles, CA
Fei Li  University of California at Los Angeles, Los Angeles, CA
Lei He  University of California at Los Angeles, Los Angeles, CA
Sponsors
ACM: Association for Computing Machinery
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 6,   Downloads (12 Months): 39,   Citation Count: 11
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ABSTRACT

In this paper, we present power models with clock and temperature scaling, and develop the first of its type coupled thermal and power simulation with temperature-dependent leakage power model at micro-architecture level. We show that leakage energy and total energy can be different by up to 2.5X and 2X for temperatures between 90°C and 130°C, respectively. Given such big energy variations, no power model at microarchitecture level is accurate without considering temperature dependent leakage models.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

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R. Viswanath, V. Wakharkar, A. Watew, and V. Lbonheur, "Thermal performance challenges from silicon to systems," Intel Technology Journal, vol. 3, 2000.
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H. Hanson, M. Hrishikesh, V. Agarwal, S. Keckler, and D. Burger, "Static energy reduction techniques for microprocessor caches," in Proceedings of the International Conference on Computer Design, 2001.
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T. Burd, T. Pering, A. Stratakos, and R. Bordersen, "A dynamic voltage-scaled microprocessor system," in 2000 IEEE International Solid-State Circuits Conference Digest of Technical Papers, Feb 2000.

CITED BY  11