| Microarchitecture level power and thermal simulation considering temperature dependent leakage model |
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International Symposium on Low Power Electronics and Design
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Proceedings of the 2003 international symposium on Low power electronics and design
table of contents
Seoul, Korea
SESSION: Temperature and power aware architectures
table of contents
Pages: 211 - 216
Year of Publication: 2003
ISBN:1-58113-682-X
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Authors
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Weiping Liao
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University of California at Los Angeles, Los Angeles, CA
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Fei Li
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University of California at Los Angeles, Los Angeles, CA
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Lei He
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University of California at Los Angeles, Los Angeles, CA
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Downloads (6 Weeks): 6, Downloads (12 Months): 39, Citation Count: 11
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ABSTRACT
In this paper, we present power models with clock and temperature scaling, and develop the first of its type coupled thermal and power simulation with temperature-dependent leakage power model at micro-architecture level. We show that leakage energy and total energy can be different by up to 2.5X and 2X for temperatures between 90°C and 130°C, respectively. Given such big energy variations, no power model at microarchitecture level is accurate without considering temperature dependent leakage models.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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L. Li , Ismail Kadayif , Yuh-Fang Tsai , Narayanan Vijaykrishnan , Mahmut T. Kandemir , Mary Jane Irwin , Anand Sivasubramaniam, Leakage Energy Management in Cache Hierarchies, Proceedings of the 2002 International Conference on Parallel Architectures and Compilation Techniques, p.131-140, September 22-25, 2002
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CITED BY 11
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G. Paci , P. Marchal , F. Poletti , L. Benini, Exploring "temperature-aware" design in low-power MPSoCs, Proceedings of the conference on Design, automation and test in Europe: Proceedings, March 06-10, 2006, Munich, Germany
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Michael Healy , Mario Vittes , Mongkol Ekpanyapong , Chinnakrishnan Ballapuram , Sung Kyu Lim , Hsien-Hsin S. Lee , Gabriel H. Loh, Microarchitectural floorplanning under performance and thermal tradeoff, Proceedings of the conference on Design, automation and test in Europe: Proceedings, March 06-10, 2006, Munich, Germany
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Sungpack Hong , Sungjoo Yoo , Byeong Bin , Kyu-Myung Choi , Soo-Kwan Eo , Taehwan Kim, Dynamic voltage scaling of supply and body bias exploiting software runtime distribution, Proceedings of the conference on Design, automation and test in Europe, March 10-14, 2008, Munich, Germany
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