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Full chip leakage estimation considering power supply and temperature variations
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Source International Symposium on Low Power Electronics and Design archive
Proceedings of the 2003 international symposium on Low power electronics and design table of contents
Seoul, Korea
SESSION: Leakage estimation table of contents
Pages: 78 - 83  
Year of Publication: 2003
ISBN:1-58113-682-X
Authors
Haihua Su  IBM Corp., Austin, TX
Frank Liu  IBM Corp., Austin, TX
Anirudh Devgan  IBM Corp., Austin, TX
Emrah Acar  IBM Corp., Austin, TX
Sani Nassif  IBM Corp., Austin, TX
Sponsors
ACM: Association for Computing Machinery
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 25,   Downloads (12 Months): 120,   Citation Count: 41
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ABSTRACT

Leakage power is emerging as a key design challenge in current and future CMOS designs. Since leakage is critically dependent on operating temperature and power supply, we present a full chip leakage estimation technique which accurately accounts for power supply and temperature variations. State of the art techniques are used to compute the thermal and power supply profile of the entire chip. Closed-form models are presented which relate leakage to temperature and VDD variations. These models coupled with the thermal and VDD profile are used to generate an accurate full chip leakage estimation technique considering environmental variations. The results of this approach are demonstrated on large-scale industrial designs.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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CITED BY  41

Collaborative Colleagues:
Haihua Su: colleagues
Frank Liu: colleagues
Anirudh Devgan: colleagues
Emrah Acar: colleagues
Sani Nassif: colleagues