ACM Home Page
Please provide us with feedback. Feedback
A topologically adaptable cellular router
Full text PdfPdf (716 KB)
Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 13th Design Automation Conference table of contents
San Francisco, California, United States
Pages: 161 - 167  
Year of Publication: 1976
Author
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
IEEE-CS\DATC : IEEE Computer Society
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 1,   Downloads (12 Months): 4,   Citation Count: 2
Additional Information:

abstract   references   cited by   index terms  

Tools and Actions: Request Permissions Request Permissions    Review this Article  
DOI Bookmark: Use this link to bookmark this Article: http://doi.acm.org/10.1145/800146.804809
What is a DOI?

ABSTRACT

This paper describes a printed circuit routing program based on a cellular least-cost path finding algorithm. The program uses four bits of random access storage per cell and provides a mechanism for programming the path-cost function to model a variety of physical constraints.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
 
2
 
3
 
4
Moore, E. F., "The Shortest Path Through a Maze," Proceedings of an International Symposium on the Theory of Switching - Part 2, The Annals of the Computation Laboratory of Harvard University, Harvard University Press, Vol. 30(1959), pp. 285-292, April 1957. Bell System Monograph Number 3523.
 
5
Parks, H. L., "Three-dimensional IC packaging - with a twist," Electronics, Vol. 45, No. 3, pp. 62-65, January 1972.
 
6
Lee, C. Y., "An Algorithm for Path Connections and its Applications," IRE Transactions on Electronic Computers, Vol. EC-10, pp. 346-365, September 1961.
 
7
Danzig, A. C., "A Multiwire Writing Technology for Advanced Electronics Packaging," Proceedings of the Technical Program of the National Electronic Packaging and Production Conference, pp. 141-147, June 1973.