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A survey of techniques for energy efficient on-chip communication
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 40th annual Design Automation Conference table of contents
Anaheim, CA, USA
SESSION: Energy-aware system design table of contents
Pages: 900 - 905  
Year of Publication: 2003
ISBN:1-58113-688-9
Authors
Vijay Raghunathan  UC Los Angeles, CA
Mani B. Srivastava  UC Los Angeles, CA
Rajesh K. Gupta  UC San Diego, CA
Sponsor
ACM: Association for Computing Machinery
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 25,   Downloads (12 Months): 142,   Citation Count: 22
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ABSTRACT

Interconnects have been shown to be a dominant source of energy consumption in modern day System-on-Chip (SoC) designs. With a large (and growing) number of electronic systems being designed with battery considerations in mind, minimizing the energy consumed in on-chip interconnects becomes crucial. Further, the use of nanometer technologies is making it increasingly important to consider reliability issues during the design of SoC communication architectures. Continued supply voltage scaling has led to decreased noise margins, making interconnects more susceptible to noise sources such as crosstalk, power supply noise, radiation induced defects, etc. The resulting transient faults cause the interconnect to behave as an unreliable transport medium for data signals. Therefore, fault tolerant communication mechanisms, such as Automatic Repeat Request (ARQ), Forward Error Correction (FEC), etc., which have been widely used in the networking community, are likely to percolate to the SoC domain.This paper presents a survey of techniques for energy efficient on-chip communication. Techniques operating at different levels of the communication design hierarchy are described, including circuit-level techniques, such as low voltage signaling, architecture-level techniques, such as communication architecture selection and bus isolation, system-level techniques, such as communication based power management and dynamic voltage scaling for interconnects, and network-level techniques, such as error resilient encoding for packetized on-chip communication. Emerging technologies, such as Code Division Multiple Access (CDMA) based buses, and wireless interconnects are also surveyed.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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CITED BY  22

Collaborative Colleagues:
Vijay Raghunathan: colleagues
Mani B. Srivastava: colleagues
Rajesh K. Gupta: colleagues