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ABSTRACT
Chemical-mechanical planarization (CMP) and other manufacturing steps in very deep-submicron VLSI have varying effects on device and interconnect features, depending on the local layout density. To improve manufacturability and performance predictability, area fill features are inserted into the layout to improve uniformity with respect to density criteria. However, the performance impact of area fill insertion is not considered by any fill method in the literature. In this paper, we first review and develop estimates for capacitance and timing overhead of area fill insertions. We then give the first formulations of the Performance Impact Limited Fill (PIL-Fill) problem with the objective of either minimizing total delay impact (MDFC) or maximizing the minimum slack of all nets (MSFC), subject to inserting a given prescribed amount of fill. For the MDFC PIL-Fill problem, we describe three practical solution approaches based on Integer Linear Programming (ILP-I and ILP-II) and the Greedy method. For the MSFC PIL-Fill problem, we describe an iterated greedy method that integrates call to an industry static timing analysis tool. We test our methods on layout testcases obtained from industry. Compared with the normal fill method [3], our ILP-II method for MDFC PIL-Fill problem achieves between 25-% and 90% reduction in terms of total weighted edge delay (roughly, a measure of sum of node slacks) impact while maintaining identical quality of the layout density control; and our iterated greedy method for MSFC PIL-Fill problem also shows significant advantage with respect to the minimum slack of nets on post-fill layout.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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1
|
N. D. Arora, K. V. Raol, R. Schumann, and L. M. Richardson, "Modeling and Extraction of Interconnect Capacitances for Multi-layer VLSI Circuits," IEEE Trans. on Computer-Aided Design 15(1) (1996), pp. 58--67.
|
| |
2
|
E. Barke, "Line-to-Ground Capacitance Calculation for VLSI: A Comparison", IEEE Trans. on Computer-Aided Design 7(2) (1988), pp. 295--298.
|
| |
3
|
Y. Chen, A. B. Kahng, G. Robins and A. Zelikovsky, "Dummy Fill Synthesis for Uniform Layout Density", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems 21(10) (2002), pp. 1132--1147.
|
 |
4
|
Yu Chen , Andrew B. Kahng , Gabriel Robins , Alexander Zelikovsky, Closing the smoothness and uniformity gap in area fill synthesis, Proceedings of the 2002 international symposium on Physical design, April 07-10, 2002, San Diego, CA, USA
[doi> 10.1145/505388.505422]
|
| |
5
|
J. Chern, J. Huang, L. Aldredge, P. Li and P. Yang, "Multilevel Metal Capacitance Models for Interconnect Capacitances", IEEE Electron Device Lett EDL-14 (1992), pp. 32--43.
|
 |
6
|
Jason Cong , Lei He , Andrew B. Kahng , David Noice , Nagesh Shirali , Steve H.-C. Yen, Analysis and justification of a simple, practical 2 1/2-D capacitance extraction methodology, Proceedings of the 34th annual conference on Design automation, p.627-632, June 09-13, 1997, Anaheim, California, United States
[doi> 10.1145/266021.266303]
|
| |
7
|
W. C. Elmore, "The Transient Response of Damped Linear Networks with Particular Regard to Wideband Amplifiers", Journal of Applied Physics (1948), pp. 55--63.
|
 |
8
|
W. Grobman , M. Thompson , R. Wang , C. Yuan , R. Tian , E. Demircan, Reticle enhancement technology: implications and challenges for physical design, Proceedings of the 38th conference on Design automation, p.73-78, June 2001, Las Vegas, Nevada, United States
[doi> 10.1145/378239.378332]
|
 |
9
|
Andrew B. Kahng , Sudhakar Muddu , Egino Sarto, On switch factor based analysis of coupled RC interconnects, Proceedings of the 37th conference on Design automation, p.79-84, June 05-09, 2000, Los Angeles, California, United States
[doi> 10.1145/337292.337318]
|
| |
10
|
Praesagus, Inc., http://www.praesagus.com/
|
| |
11
|
B. E. Stine, D. S. Boning et al., "The Physical and Electrical Effects of Metal Fill Patterning Practices for Oxide Chemical Mechanical Polishing Processes", IEEE Trans. on Electron Devices 45(3) (1998), pp. 665--679.
|
 |
12
|
A. Toulouse , D. Bernard , C. Landrault , P. Nouet, Efficient 3D modelling for extraction of interconnect capacitances in deep submicron dense layouts, Proceedings of the conference on Design, automation and test in Europe, p.115-es, January 1999, Munich, Germany
[doi> 10.1145/307418.307567]
|
| |
13
|
UbiTech. Inc., http://www.ubitechnology.com/
|
| |
14
|
XYALIS, http://www.xyalis.com/
|
CITED BY 8
|
|
|
|
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Lei He , Andrew Kahng , King Ho Tam , Jinjun Xiong, Simultaneous buffer insertion and wire sizing considering systematic CMP variation and random leff variation, Proceedings of the 2005 international symposium on Physical design, April 03-06, 2005, San Francisco, California, USA
|
|
|
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|
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Hua Xiang , Liang Deng , Ruchir Puri , Kai-Yuan Chao , Martin D.F. Wong, Dummy fill density analysis with coupling constraints, Proceedings of the 2007 international symposium on Physical design, March 18-21, 2007, Austin, Texas, USA
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