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Repeater insertion and wire sizing optimization for throughput-centric VLSI global interconnects
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Source International Conference on Computer Aided Design archive
Proceedings of the 2002 IEEE/ACM international conference on Computer-aided design table of contents
San Jose, California
Pages: 280 - 284  
Year of Publication: 2002
ISBN ~ ISSN:1092-3152 , 0-7803-7607-2
Authors
Harshit Shah  Georgia Institute of Technology, Atlanta, GA
Pun Shiu  Georgia Institute of Technology, Atlanta, GA
Brian Bell  Georgia Institute of Technology, Atlanta, GA
Mamie Aldredge  Georgia Institute of Technology, Atlanta, GA
Namarata Sopory  Georgia Institute of Technology, Atlanta, GA
Jeff Davis
Sponsors
: IEEE Circuits & Systems Society
IEEE-CS\DATC : IEEE Computer Society
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 15,   Downloads (12 Months): 50,   Citation Count: 7
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ABSTRACT

As technology advances towards billion transistor systems, the cost of complex wire networks will require area efficient wiring methodologies. This paper explores the tradeoffs between wire latency, throughput and area for deep submicron (DSM) interconnect technologies. From basic physical models, optimal wiring sizing for repeater networks are rigorously derived and compared to HSPICE simulations. Key case studies from 250nm to 70nm technologies reveal that significant wire area reduction (20--50%) can be achieved with optimal wire sizing to maximize the throughput per unit wire area.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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CITED BY  7

Collaborative Colleagues:
Harshit Shah: colleagues
Pun Shiu: colleagues
Brian Bell: colleagues
Mamie Aldredge: colleagues
Namarata Sopory: colleagues
Jeff Davis: colleagues