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Source International Symposium on Physical Design archive
Proceedings of the 2003 international symposium on Physical design table of contents
Monterey, CA, USA
SESSION: Session 3: From the Trenches (invited) table of contents
Pages: 48 - 50  
Year of Publication: 2003
ISBN:1-58113-650-1
Authors
Leon Stok  IBM TJ Watson Research Center, Yorktown Heights, NY
John Cohn  IBM Micro-Electronics, Essex-Junction, VT
Sponsors
ACM: Association for Computing Machinery
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 2,   Downloads (12 Months): 15,   Citation Count: 3
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REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

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Sunderland, David, Cohn John, Stok, Leon, "Multi-Mission, Multi-Kernel Processor (MKP) Study" DARPA Contract MDA972-01-C-0015, November 2002.
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