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Dispatching heuristic for wafer fabrication
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Source Winter Simulation Conference archive
Proceedings of the 33nd conference on Winter simulation table of contents
Arlington, Virginia
SESSION: Semiconductor manufacturing table of contents
Pages: 1215 - 1219  
Year of Publication: 2001
ISBN:0-7803-7309-X
Authors
Loo Hay Lee  National University of Singapore, Kent Ridge, Singapore 119260 SINGAPORE
Loon Ching Tang  National University of Singapore, Kent Ridge, Singapore 119260 SINGAPORE
Soon Chee Chan  National University of Singapore, Kent Ridge, Singapore 119260 SINGAPORE
Sponsors
INFORMS/CS : Institute for Operations Research and the Management Sciences/College on Simulation
IEEE/SMCS : Institute of Electrical and Electronics Engineers/Systems, Man, and Cybernetics Society
NIST : National Institute of Standards and Technology
ACM: Association for Computing Machinery
SCS : The Society for Computer Simulation International
SIGSIM: ACM Special Interest Group on Simulation and Modeling
IIE : Institute of Industrial Engineers
IEEE/CS : Institute of Electrical and Electronics Engineers/Computer Society
ASA : American Statistical Association
Publisher
IEEE Computer Society  Washington, DC, USA
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ABSTRACT

As the semiconductor industry moves into the next millennium, companies increasingly will be faced with production obstacles that impede their ability to remain competitive. Effective equipment and line management planning will increasingly be required to maximize profitability while maintaining the flexibility to keep pace with rapidly changing manufacturing environment. In this paper, the authors present a two-bottleneck machines center model for wafer operations analysis. A new dispatching rule Balance Work Content, BWC, is introduced. This is a selective dispatching rule whereby it attempts to maximize the utilization of bottleneck machine. A systematic approach to assessing the impact of BWC is presented. Extensive simulation runs on both the deterministic and stochastic models developed shows its supremacy over conventional approaches of FIFO and SPT.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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Collaborative Colleagues:
Loo Hay Lee: colleagues
Loon Ching Tang: colleagues
Soon Chee Chan: colleagues