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HSpeedEx: a high-speed extractor for substrate noise analysis in complex mixed signal SOC
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 39th annual Design Automation Conference table of contents
New Orleans, Louisiana, USA
SESSION: Inductance and substrate analysis table of contents
Pages: 767 - 770  
Year of Publication: 2002
ISBN ~ ISSN:0738-100X , 1-58113-461-4
Authors
Adil Koukab  Swiss Federal Institute of Technology (EPFL), Electronics Laboratory CH-1015 Lausanne, Switzerland
Catherine Dehollain  Swiss Federal Institute of Technology (EPFL), Lausanne, Switzerland
Michel Declercq  Swiss Federal Institute of Technology (EPFL), Lausanne, Switzerland
Sponsor
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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ABSTRACT

The unprecedented impact of noise coupling on Mixed-Signal Systems-On-a-Chip (MS-SOC) functionality, brings a new set of challenges for Electronics Design Automation (EDA) tool developers. In this paper, we propose a new approach which combines a thorough physical comprehension of the noise coupling effects with an improved Boundary-Element-Method (BEM) to accelerate the substrate model extraction and to avoid the dense matrix storage. The low computational efforts required, as well as speed and accuracy reached, makes this method a highly promising alternative to verify complex MS-SOCs.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

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Collaborative Colleagues:
Adil Koukab: colleagues
Catherine Dehollain: colleagues
Michel Declercq: colleagues