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Understanding and addressing the impact of wiring congestion during technology mapping
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Source International Symposium on Physical Design archive
Proceedings of the 2002 international symposium on Physical design table of contents
San Diego, CA, USA
SESSION: Poster Paper Introductions table of contents
Pages: 131 - 136  
Year of Publication: 2002
ISBN:1-58113-460-6
Authors
Davide Pandini  STMicroelectronics, Agrate Brianza, Italy
Lawrence T. Pileggi  Carnegie Mellon University, Pittsburgh, PA
Andrzej J. Strojwas  Carnegie Mellon University, Pittsburgh, PA
Sponsor
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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ABSTRACT

Traditionally, interconnect effects are taken into account during logic synthesis via wireload models, but their ineffectiveness for DSM technologies has been demonstrated and various physical synthesis approaches have been spawned to address the problem. Of particular interest is that logic block size is no longer dictated exclusively by total cell area, yet synthesis optimization objectives are aimed specifically at minimizing the number and size of cells. Methodologies that incorporate congestion within the logic synthesis objective function have been proposed in [9][10][11] and [15]; however, as we will demonstrate, predicting the true congestion prior to layout is not possible, and the efficacy of any approach can only be evaluated after routing is completed within the fixed die size. In this paper we propose a practical, complete methodology which first performs congestion-aware technology mapping using a global weighting factor for the cost function [15], and then applies incremental localized unmapping and remapping on congested areas. This complete approach addresses the problem that one global factor is not ideally suited for all regions of the designs. Most importantly, through the application of this methodology to industrial examples we will show that any attempt at a purely top-down single-pass congestion-aware technology mapping is merely wishful thinking.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
H. B. Bakoglu. "Circuits, Interconnections and Packaging". Addison Wesley, Reading, MA, 1990.
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E. Detjens, G. Gannot, R. Rudell, A. Sangiovanni-Vincentelli, and A. Wang. "Technology Mapping in MIS". In Proc. ACM/IEEE Intl. Conf. on Computer-Aided Design, pages 116--119, Nov. 1987.
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A. H. Salek, J. Lou, and M. Pedram. "An Integrated Logical and Physical Design Flow for Deep Submicron Circuits". IEEE Transac¿tions on CAD, vol. 18, no. 9, pages 1305--1315, Sept. 1999.
 
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M. Pedram, and N. Bhat. "Layout Driven Logic Restructuring/Decomposition". In Proc. ACM/IEEE Intl. Conf. on Computer-Aided Design, pages 134--137, Nov. 1991.
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G. Meixner, and U. Lauther. "Congestion-Driven Placement Using a New Multi-Partitioning Heuristic". In Proc. ACM/IEEE Intl. Conf. on Comp. Aided Design, pages 332--335, Nov. 1990.
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M. Borgatti, F. Lertora, B. Foiret, and L. Cali'. "A Reconfigurable System featuring Dynamically Extensible Embedded Microprocessor, FPGA and Customisable I/O". In Proc. IEEE CICC, May 2002.


Collaborative Colleagues:
Davide Pandini: colleagues
Lawrence T. Pileggi: colleagues
Andrzej J. Strojwas: colleagues