| Estimation of power distribution in VLSI interconnects |
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International Symposium on Low Power Electronics and Design
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Proceedings of the 2001 international symposium on Low power electronics and design
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Huntington Beach, California, United States
Pages: 370 - 375
Year of Publication: 2001
ISBN:1-58113-371-5
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Authors
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Youngsoo Shin
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Center for Collaborative Research and Institute of Industrial Science, University of Tokyo, Tokyo 153-8505, Japan
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Takayasu Sakurai
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Center for Collaborative Research and Institute of Industrial Science, University of Tokyo, Tokyo 153-8505, Japan
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REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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Kaustav Banerjee , Amit Mehrotra , Alberto Sangiovanni-Vincentelli , Chenming Hu, On thermal effects in deep sub-micron VLSI interconnects, Proceedings of the 36th ACM/IEEE conference on Design automation, p.885-891, June 21-25, 1999, New Orleans, Louisiana, United States
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C. K. Cheng, J. Lillis, S. Lin, and N. Chang, Interconnect Analysis and Synthesis, John Wiley & Sons, Inc., 2000.
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L. Miguel Silveira , Mattan Kamon , Jacob White, Efficient reduced-order modeling of frequency-dependent coupling inductances associated with 3-D interconnect structures, Proceedings of the 32nd ACM/IEEE conference on Design automation, p.376-380, June 12-16, 1995, San Francisco, California, United States
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Altan Odabasioglu , Mustafa Celik , Lawrence T. Pileggi, PRIMA: passive reduced-order interconnect macromodeling algorithm, Proceedings of the 1997 IEEE/ACM international conference on Computer-aided design, p.58-65, November 09-13, 1997, San Jose, California, United States
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T. Sakurai, "Approximation of wiring delay in MOSFET LSI," IEEE Journal of Solid-State Circuits, vol. SC-18, no. 4, pp. 418-426, Aug. 1983.
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