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Using conduction modes basis functions for efficient electromagnetic anaysis of on-chip and off-chip interconnect
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 38th annual Design Automation Conference table of contents
Las Vegas, Nevada, United States
Pages: 563 - 566  
Year of Publication: 2001
ISBN:1-58113-297-2
Authors
Luca Daniel  University of California, Berkeley
Alberto Sangiovanni  Univ. of California, Berkeley
Jacob White  Massachusetts Institute of Technology
Sponsors
EDAC : Electronic Design Automation Consortium
IEEE-CAS : Circuits & Systems
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 5,   Downloads (12 Months): 17,   Citation Count: 9
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ABSTRACT

In this paper, we present an efficient method to model the interior of the conductors in a quasi-static or full-wave integral equation solver. We show how interconnect cross-sectional current distributions can be modeled using a small number of conduction modes as basis functions for the discretization of the Mixed Potential Integral Equation (MPIE). Two examples are presented to demonstrate the computational attractiveness of our method. In particular, we show how our new approach can successfully and efficiently capture skin effects, proximity effects and transmission line resonances.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
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5
E. Tuncer, B. T. Lee, and D. P. Neikirk. Interconnect Series Impedance Determination Using a Surface Ribbon Method. IEEE Topical Meeting on Electrical Performance of Electronic Packaging, pages 250-252, November 1994.
 
6
K. M. Coperich, A. E. Ruehli, and A. Cangellaris. Enhanced Skin Effect for Partial-Element Equivalent-Circuit (PEEC) Models. IEEE Trans. on Microwave Theory and Techniques, 48(9):1435-42, September 2000.
 
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8
A. E. Ruehli. Equivalent Circuit Models for Three Dimensional Multiconductor Systems. IEEE Trans. on Microwave Theory and Techniques, 22:216-221, March 1974.
 
9
E. M. Deeley. Surface Impedance near Edges and Corners in Three-Dimensional Media. IEEE Trans. on Magnetics, 2:712-714, 1990.

CITED BY  10

Collaborative Colleagues:
Luca Daniel: colleagues
Alberto Sangiovanni: colleagues
Jacob White: colleagues