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Testing for interconnect crosstalk defects using on-chip embedded processor cores
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 38th annual Design Automation Conference table of contents
Las Vegas, Nevada, United States
Pages: 317 - 320  
Year of Publication: 2001
ISBN:1-58113-297-2
Authors
Li Chen  Dept. ECE, University of California at San Diego, La Jolla, CA
Xiaoliang Bai  Dept. ECE, University of California at San Diego, La Jolla, CA
Sujit Dey  Dept. ECE, University of California at San Diego, La Jolla, CA
Sponsors
EDAC : Electronic Design Automation Consortium
IEEE-CAS : Circuits & Systems
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 2,   Downloads (12 Months): 8,   Citation Count: 3
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ABSTRACT

Crosstalk effects degrade the integrity of signals traveling on long interconnects and must be addressed during manufacturing testing. External testing for crosstalk is expensive due to the need for high-speed testers. Built-in self-test, while eliminating the need for a high-speed tester, may lead to excessive test overhead as well as overly aggressive testing. To address this problem, we propose a new software-based self-test methodology for system-on-chips (SoC) based on embedded processors. It enables an on-chip embedded processor core to test for crosstalk in system-level interconnects by executing a self-test program in the normal operational mode of the SoC. We have demonstrated the feasibility of this method by applying it to test the interconnects of a processor-memory system. The defect coverage was evaluated using a system-level crosstalk defect simulation method.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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The International Technology Roadmap for Semiconductors, Semiconductor Industry Association, 1999.
 
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L. Chen and S. Dey, "Software-based self-testing methodology for processor cores," IEEE Trans. Computer-Aided Designs, vol.20, no.3, March 2001.
 
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K. Radecka, J. Rajski, and J. Tyszer, "Arithmetic built-in self-test for DSP cores," IEEE Trans. Computer-Aided Design, vol.16, no.11, Nov. 1997, pp. 1358 - 69.
 
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Collaborative Colleagues:
Li Chen: colleagues
Xiaoliang Bai: colleagues
Sujit Dey: colleagues