| An efficient analytical model of coupled on-chip RLC interconnects |
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Asia and South Pacific Design Automation Conference
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Proceedings of the 2001 Asia and South Pacific Design Automation Conference
table of contents
Yokohama, Japan
Pages: 385 - 390
Year of Publication: 2001
ISBN:0-7803-6634-4
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Authors
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Liang Yin
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Electrical and Computer Engineering Department, University of Wisconsin, Madison, WI
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Lei He
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Electrical and Computer Engineering Department, University of Wisconsin, Madison, WI
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Downloads (6 Weeks): 2, Downloads (12 Months): 35, Citation Count: 8
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ABSTRACT
In this paper, we present a new decoupled model for two coupled transmission lines with consideration of the inductive effect. It maps two coupled lines into two completely isolated lines with separated drivers and receivers, and has no loss of accuracy during the decoupling procedure. Further, we derive a closed-form time domain response for an isolated transmission line using a one-segment RLC II model. Combining the two models, we have an analytical time-domain solution to two coupled transmission lines. The model gives satisfied results for up to 5000 um-long lines when compared to SPICE simulation over an accurate distributed RLC circuit model, and can be used to model on-chip wires in the layout design, logic synthesis and high level design.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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CITED BY 8
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Seongkyun Shin , Yungseon Eo , William R. Eisenstadt , Jongin Shim, Analytical signal integrity verification models for inductance-dominant multi-coupled VLSI interconnects, Proceedings of the 2002 international workshop on System-level interconnect prediction, April 06-07, 2002, San Diego, California, USA
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