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An efficient analytical model of coupled on-chip RLC interconnects
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Source Asia and South Pacific Design Automation Conference archive
Proceedings of the 2001 Asia and South Pacific Design Automation Conference table of contents
Yokohama, Japan
Pages: 385 - 390  
Year of Publication: 2001
ISBN:0-7803-6634-4
Authors
Liang Yin  Electrical and Computer Engineering Department, University of Wisconsin, Madison, WI
Lei He  Electrical and Computer Engineering Department, University of Wisconsin, Madison, WI
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
IPSJ : Information Processing Society of Japan
IEEE HK CAS : IEEE HK CAS and Comm. Joint Chapter
IEICE : Inst of Electronics, Info & Communication Engineers
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 2,   Downloads (12 Months): 35,   Citation Count: 8
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ABSTRACT

In this paper, we present a new decoupled model for two coupled transmission lines with consideration of the inductive effect. It maps two coupled lines into two completely isolated lines with separated drivers and receivers, and has no loss of accuracy during the decoupling procedure. Further, we derive a closed-form time domain response for an isolated transmission line using a one-segment RLC II model. Combining the two models, we have an analytical time-domain solution to two coupled transmission lines. The model gives satisfied results for up to 5000 um-long lines when compared to SPICE simulation over an accurate distributed RLC circuit model, and can be used to model on-chip wires in the layout design, logic synthesis and high level design.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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Tom Dhaene and Daniel De Zutter, "Selection of Lumped Element Models for Coupled Lossy Transmission Lines", IEEE Transactions on Computer- Aided Design, Vol. 11, No. 7, pp.805-815, July, 1992.
 
4
A. R. Djordjevic, T. K. Sarkar and R. F. Harrinton, "Time Domain Response of Multiconductir Transmission Lines", Proc. IEEE, vol. 75, pp.743-764, June 1987.
 
5
E. Elmore, "The Transient Response of Damped Linear Network with Particular Regard to Wideband Amplifiers", Journal of Applied Physics, pp.55-63, Jan, 1948.
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K. D. Granzow "Digital Transmission Lines", Oxford University Press, 1998
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L. He and M. Xu, "Characteristics and Modeling for On-Chip Inductive Coupling", Univ. of Wisconsin-Madison Technique Report, ECE-00-01. http://eda.ece.wisc.edu/publications.html
 
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Y. I. Ismail, E. G. Friedman and J. L. Neves, "Equivalent Elmore Delay for RLC Trees", IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 19, No. 1, Jan 2000.
 
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12
13
 
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T. Sakuri, "Closed-form expressions for interconnection delay, coupling, and crosstalk in VLSI's", IEEE Transactions on Electron Devices, vol. 40, pp. 118-124, Jan. 1993.
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V. K. Tripathi and J. B. Rettig, "A Spice Model for Multiple Coupled Microstrips and Other Transmission Lines", IEEE Transactions on Microwave Theory and Techniques, Vol. MTT-33, No. 12, pp. 1513-1518, Dec 1985.

CITED BY  8