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A virtual 3-D multipole accelerated extractor for VLSI parasitic interconnect capacitance
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Source Asia and South Pacific Design Automation Conference archive
Proceedings of the 2001 Asia and South Pacific Design Automation Conference table of contents
Yokohama, Japan
Pages: 214 - 218  
Year of Publication: 2001
ISBN:0-7803-6634-4
Authors
Zhaozhi Yang  Dept. of Computer Science and Technology, Tsinghua University, Beijing 100084, China
Zeyi Wang  Dept. of Computer Science and Technology, Tsinghua University, Beijing 100084, China
Shuzhou Fang  Dept. of Computer Science and Technology, Tsinghua University, Beijing 100084, China
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
IPSJ : Information Processing Society of Japan
IEEE HK CAS : IEEE HK CAS and Comm. Joint Chapter
IEICE : Inst of Electronics, Info & Communication Engineers
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 3,   Downloads (12 Months): 10,   Citation Count: 2
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ABSTRACT

A virtual 3-D extractor of the single dielectric is presented in this paper. In the indirect boundary integral equations, the plane charge distribution on the surface of conductors is replaced with mesh charge distribution, and we use the multipole-accelerated algorithm to further depress the computational complexity. Numerical results show that its computational complexity is about O(n), where n is the number of the discrete variables. Within the comparable accuracy, it runs several times faster than the Fastcap, which is a very advanced multipole-accelerated parasitic capacitance extractor now.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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K. Nabors and J. White, "Multipole accelerated capacitance extraction algorithm for 3-D structures with multiple dielectrics," IEEE Trans. CAS, Vol.39, No. 11, pp.946-954,Nov. 1992
 
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K. Nabors and J. White, "Fastcap: A multipole accelerated 3-D capacitance extraction program," IEEE Trans. CAD ,Vol.10,No.11,pp.1447- 1459,Nov. 1991
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Z. Wang, Y. Yuan and Q. Wu, "A Paralled Multipole Accelerated 3-D Capacitance Simulator Based on an Improved Model," IEEE Trans. CAD, Vol. 15, No.12, pp1441-1450,1996
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U.Choudhury and A.Sangiovanni-Vincentelli, "Automatic Generation of Analytical Models for Interconnect Capacitance," IEEE Trans. CAD, Vol. 14,No.4,pp.470-480, 1995
 
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N.D.Arora, K.V.Raoe, R.Schumann and L.M.Richardson, "Modeling and Extraction of Interconnect Capacitance for Multilayer VLSI Circuits,"IEEE Trans. CAD, Vol. 15, No. 1, pp.58-67,1996
 
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Collaborative Colleagues:
Zhaozhi Yang: colleagues
Zeyi Wang: colleagues
Shuzhou Fang: colleagues