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Modeling and forecasting of manufacturing variations (embedded tutorial)
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Source Asia and South Pacific Design Automation Conference archive
Proceedings of the 2001 Asia and South Pacific Design Automation Conference table of contents
Yokohama, Japan
Pages: 145 - 150  
Year of Publication: 2001
ISBN:0-7803-6634-4
Author
Sani R. Nassif  IBM Austin Research Laboratory, 11501 Burnet Rd., Austin, TX
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
IPSJ : Information Processing Society of Japan
IEEE HK CAS : IEEE HK CAS and Comm. Joint Chapter
IEICE : Inst of Electronics, Info & Communication Engineers
Publisher
ACM  New York, NY, USA
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ABSTRACT

Process-induced variations are an important consideration in the design of integrated circuits. Until recently, it was sufficient to model die-to-die shifts in device performance, leading to the well known worst-case modeling and design methodology [1, 2]. However, current and near-future in-tegrated circuits are large enough that device and intercon-nect parameter variations within the chip are as important as those same variations from chip to chip. This presents a new set of challenges for process modeling and characterization and for the associated design tools and method-ologies. This paper examines the sources and trends of process variability, the new challenges associated with the increase in within-die variability analysis, and proposes a modeling and simulation methodology to deal with this variability.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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