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ABSTRACT
Process-induced variations are an important consideration in the design of integrated circuits. Until recently, it was sufficient to model die-to-die shifts in device performance, leading to the well known worst-case modeling and design methodology [1, 2]. However, current and near-future in-tegrated circuits are large enough that device and intercon-nect parameter variations within the chip are as important as those same variations from chip to chip. This presents a new set of challenges for process modeling and characterization and for the associated design tools and method-ologies. This paper examines the sources and trends of process variability, the new challenges associated with the increase in within-die variability analysis, and proposes a modeling and simulation methodology to deal with this variability.
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Choongyeun Cho , Daeik Kim , Jonghae Kim , Jean-Olivier Plouchart , Robert Trzcinski, Statistical framework for technology-model-product co-design and convergence, Proceedings of the 44th annual conference on Design automation, June 04-08, 2007, San Diego, California
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