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Hierarchical dummy fill for process uniformity
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Source Asia and South Pacific Design Automation Conference archive
Proceedings of the 2001 Asia and South Pacific Design Automation Conference table of contents
Yokohama, Japan
Pages: 139 - 144  
Year of Publication: 2001
ISBN:0-7803-6634-4
Authors
Yu Chen  Computer Science Department, UCLA, Los Angeles, CA
Andrew B. Kahng  UCSD CSE and ECE Departments, La Jolla, CA
Gabriel Robins  Department of Computer Science, University of Virginia, Charlottesville, VA
Alexander Zelikovsky  Department of Computer Science, Georgia State University, Atlanta, GA
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
IPSJ : Information Processing Society of Japan
IEEE HK CAS : IEEE HK CAS and Comm. Joint Chapter
IEICE : Inst of Electronics, Info & Communication Engineers
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 5,   Downloads (12 Months): 18,   Citation Count: 6
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ABSTRACT

To improve manufacturability and performance predictability, we seek to make a layout uniform with respect to prescribed density criteria, by inserting "fill" geometries into the layout. Previous approaches for at layout density control are not scalable due to the necessity of solving very large linear programs, the large data volume of the solution, and the impact of hierarchy-breaking on verification. In this paper, we give the first methods for hierarchical layout density control for process uniformity. Our approach trades off naturally between runtime, solution quality, and output data volume. We also allow generation of compressed GDSII of fill geometries. Our experiments show that this hybrid hierarchical filling approach saves data volume and is scalable, while yielding solution quality that is competitive with existing Monte-Carlo and linear programming based approaches.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

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R. R. Divecha, B. E. Stine, D. O. Ouma, J. U. Yoon, D. S. Boning, et al., "Effect of Fine-line Density and Pitch onInterconnect ILD Thickness Variation in Oxide CMP Process", Proc. CMP-MIC, 1998.
 
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A. B. Kahng, G. Robins, A. Singh, H. Wang and A. Zelikovsky, "Filling Algorithms and Analyses for Layout Density Control", IEEE Trans. Computer-Aided Design 18(4) (1999), pp. 445- 462.
 
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J. Rey, personal communication, 2000.
 
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B. Stine, "A Closed-Form Analytical Model for ILD Thickness Variation in CMP Processes", Proc. CMP-MIC, 1997.
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M. Tomozawa, "Oxide CMP Mechanisms", Solid State Technology 40(7) (1997), pp. 169-175.


Collaborative Colleagues:
Yu Chen: colleagues
Andrew B. Kahng: colleagues
Gabriel Robins: colleagues
Alexander Zelikovsky: colleagues