| Thermal-ADI: a linear-time chip-level dynamic thermal simulation algorithm based on alternating-direction-implicit (ADI) method |
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International Symposium on Physical Design
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Proceedings of the 2001 international symposium on Physical design
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Sonoma, California, United States
Pages: 238 - 243
Year of Publication: 2001
ISBN:1-58113-347-2
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Authors
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Ting-Yuan Wang
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Department of Electrical and Computer Engineering, University of Wisconsin at Madison, Madison, WI
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Charlie Chung-Ping Chen
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Department of Electrical and Computer Engineering, University of Wisconsin at Madison, Madison, WI
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Downloads (6 Weeks): 6, Downloads (12 Months): 33, Citation Count: 3
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ABSTRACT
Due to the dramatic increase of clock frequency and integration density, power density and on-chip temperature in high-end VLSI circuits rise significantly. To ensure the timing correctness and the reliability of high-end VLSI design, efficient and accurate chip-level transient thermal simulations are of crucial importance.In this paper, we develop and present an efficient transient thermal simulation algorithm based on the alternating-direction-implicit method. Our algorithm, Thermal-ADI, not only hasa linear runtime and memory requirement, but also isunconditionally stablewhich ensures that time-step is not limited by any stability requirement. Extensive experimental results show that our algorithm is not only orders of magnitude faster than the traditional thermal simulation algorithms but also highly accurate, and efficient in memory usage.
REFERENCES
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CITED BY 3
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Haihua Su , Frank Liu , Anirudh Devgan , Emrah Acar , Sani Nassif, Full chip leakage estimation considering power supply and temperature variations, Proceedings of the 2003 international symposium on Low power electronics and design, August 25-27, 2003, Seoul, Korea
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J. M. Wang , B. Srinivas , Dongsheng Ma , C. C. -P. Chen , Jun Li, System-level power and thermal modeling and analysis by orthogonal polynomial based response surface approach (OPRS), Proceedings of the 2005 IEEE/ACM International conference on Computer-aided design, p.728-735, November 06-10, 2005, San Jose, CA
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