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Thermal-ADI: a linear-time chip-level dynamic thermal simulation algorithm based on alternating-direction-implicit (ADI) method
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Source International Symposium on Physical Design archive
Proceedings of the 2001 international symposium on Physical design table of contents
Sonoma, California, United States
Pages: 238 - 243  
Year of Publication: 2001
ISBN:1-58113-347-2
Authors
Ting-Yuan Wang  Department of Electrical and Computer Engineering, University of Wisconsin at Madison, Madison, WI
Charlie Chung-Ping Chen  Department of Electrical and Computer Engineering, University of Wisconsin at Madison, Madison, WI
Sponsor
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 6,   Downloads (12 Months): 33,   Citation Count: 3
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ABSTRACT

Due to the dramatic increase of clock frequency and integration density, power density and on-chip temperature in high-end VLSI circuits rise significantly. To ensure the timing correctness and the reliability of high-end VLSI design, efficient and accurate chip-level transient thermal simulations are of crucial importance.In this paper, we develop and present an efficient transient thermal simulation algorithm based on the alternating-direction-implicit method. Our algorithm, Thermal-ADI, not only hasa linear runtime and memory requirement, but also isunconditionally stablewhich ensures that time-step is not limited by any stability requirement. Extensive experimental results show that our algorithm is not only orders of magnitude faster than the traditional thermal simulation algorithms but also highly accurate, and efficient in memory usage.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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Danqing Chen, Erhong Li, Elyse Rosenbaum, and Sung-Mo Kang," Interconect Thermal Modeling for Accurate Simulation of Circuit Timing and Reliability," IEEE Trans. Computer-Aided Design of Integrated Circuits and Systems pp197-205, Vol. 19, No. 2, Feb. 2000
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Glen E. Myers, "Analytical Methods in Conduction Heat Transfer," Journal of Digital Systems Genium Publishing Corp. Chap 8, 2nd Edition, 1998.


Collaborative Colleagues:
Ting-Yuan Wang: colleagues
Charlie Chung-Ping Chen: colleagues