ACM Home Page
Please provide us with feedback. Feedback
A benchmark suite for substrate analysis
Full text PdfPdf (254 KB)
Source Asia and South Pacific Design Automation Conference archive
Proceedings of the 2000 Asia and South Pacific Design Automation Conference table of contents
Yokohama, Japan
Pages: 617 - 622  
Year of Publication: 2000
ISBN:0-7803-5974-7
Authors
Edoardo Charbon  Cadence Design Systems, San Jose, CA
Luis Miguel Silveira  Instituto de Engenharia de Sistemas, e Computadores, Lisboa, Portugal
Paolo Miliozzi  Conxant Systems Inc., Newport Beach, CA
Sponsors
IEEE-CAS : Circuits & Systems
IPSJ : Information Processing Society of Japan
SIGDA: ACM Special Interest Group on Design Automation
IEICE : Inst of Electronics, Info & Communication Engineers
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 3,   Downloads (12 Months): 5,   Citation Count: 0
Additional Information:

references   collaborative colleagues  

Tools and Actions: Review this Article  
DOI Bookmark: Use this link to bookmark this Article: http://doi.acm.org/10.1145/368434.368835
What is a DOI?

REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
R. Gharpurey, Modeling and Analysis of Substrate Coupling in ICs, PhD thesis, University of California at Berkeley, May 1995.
 
2
T. A. Johnson, R. W. Knepper, V. Marcello and W. Wang, "Chip Substrate Resistance Modeling Technique for Integrated Circuit Design", IEEE Trans. on Computer Aided Design, vol. CAD-3, pp. 126-134, 1984.
 
3
D. K. Su, M. Loinaz, S. Masui and B. Wooley, "Experimental Results and Modeling Techniques for Substrate Noise in Mixed- Signal Integrated Circuits", IEEE Journal of Solid State Circuits, vol. SC-28, n. 4, pp. 420-430, April 1993.
 
4
K. Joardar, "A Simple Approach to Modeling Cross-Talk in Integrated Circuits", IEEE Journal of Solid State Circuits, vol. SC-29, n. 10, pp. 1212-1219, October 1994.
 
5
F. J. R. Clement, E. Zysman M. Kayal and M. Declercq, "LAYIN: Toward a Global Solution for Parasitic Coupling Modeling and Visualization", in Proc. IEEE Custom Integrated Circuit Conference, pp. 537-540, May 1994.
 
6
B. R. Stanisic, N. K. Verghese, D. J. Allstot, R. A. Rutenbar and L. R. Carley, "Addressing Substrate Coupling in Mixed-Mode ICs: Simulation and Power Distribution Synthesis", IEEE Journal of Solid State Circuits, vol. SC-29, n. 3, pp. 226-237, March 1994.
 
7
 
8
 
9
 
10
R. Gharpurey and R. G. Meyer, "Modeling and Analysis of Substrate Coupling in ICs", IEEE Journal of Solid State Circuits, vol. SC-31, n. 3, pp. 344-353, March 1996.
 
11
 
12
A. L. Sangiovanni-Vincentelli, "Circuit Simulation", in Computer Design Aids for VLSI Circuits, pp. 19-112, P. Antognetti and D. O. Pederson and H. DeMan Eds., Sijthoff & Noordhoff (The Netherlands), 1980.
 
13
 
14
15
 
16
J. P. Costa, M. Chou and L. M. Silveira, "Precorrected-DCT Techniques for Modeling and Simulation of Substrate coupling in mixedsignal IC's", in Proc. IEEE International Symposium on Circuits and Systems, volume 6, pp. 358-362, May 1998.
 
17
 
18
C. Hu, VLSI Electronics: Microstructure Science, volume 18, Academic Press, New York, 1981.
 
19
Collaborative Colleagues:
Edoardo Charbon: colleagues
Luis Miguel Silveira: colleagues
Paolo Miliozzi: colleagues