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Monte-Carlo algorithms for layout density control
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Source Asia and South Pacific Design Automation Conference archive
Proceedings of the 2000 Asia and South Pacific Design Automation Conference table of contents
Yokohama, Japan
Pages: 523 - 528  
Year of Publication: 2000
ISBN:0-7803-5974-7
Authors
Yu Chen  UCLA Department of Computer Science, Los Angeles, CA
Andrew B. Kahng  UCLA Department of Computer Science, Los Angeles, CA
Gabriel Robins  Department of Computer Science, University of Virginia, Charlottesville, VA
Alex Zelikovsky  Department of Computer Science, Georgia State University, Atlanta, GA
Sponsors
IEEE-CAS : Circuits & Systems
IPSJ : Information Processing Society of Japan
SIGDA: ACM Special Interest Group on Design Automation
IEICE : Inst of Electronics, Info & Communication Engineers
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 4,   Downloads (12 Months): 13,   Citation Count: 7
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references   cited by   collaborative colleagues  

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REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
R. R. Divecha, B. E. Stine, D. O. Ouma, J. U. Yoon, D. S. Boning, J. E. Chung, O. S. Nakagawa, and S. Y. Oh, Effect of Fine-line Density and Pitch on Interconnect ILD Thickness Variation in Oxide CMP Process, in Proc. CMP-MIC, Santa Clara, February 1998.
 
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A. B. Kahng, G. Robins, A. Singh, and A. Zelikovsky, Filling Algorithms and Analyses for Layout Density Control, IEEE Trans. Computer-Aided Design, 18 (1999), pp. 445-462.
 
7
H. Landis, P. Burke, W. Cote, W. Hill, C. Hoffman, C. Kaanta, C. Koburger, W. Lange, M. Leach, and S. Luce, Integration of Chemical-Mechanical Polishing into CMOS Integrated Circuit Manufacturing, Thin Solid Films, 220 (1992), pp. 1-7.
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G. Nanz and L. E. Camilletti, Modeling of Chemical- Mechanical Polishing: A Review, IEEE Trans. on Semiconductor Manufacturing, 8 (1995), pp. 382-389.
 
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B. E. Stine, D. S. Boning, J. E. Chung, and L. Camilletti, The Physical and Electrical Effects of Metal-fill Patterning Practices for Oxide Chemical-Mechanical Polishing Processes, IEEE Transactions on Electron Devices, 45 (1998), pp. 665- 679.
 
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M. Tomozawa, Oxide CMP Mechanisms, Solid State Technology, (1997), pp. 169-175.

CITED BY  7
Collaborative Colleagues:
Yu Chen: colleagues
Andrew B. Kahng: colleagues
Gabriel Robins: colleagues
Alex Zelikovsky: colleagues