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Standard bus vs. bus wrapper: what is the best solution for future SoC integration?
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Source Design, Automation, and Test in Europe archive
Proceedings of the conference on Design, automation and test in Europe table of contents
Munich, Germany
Pages: 776 - 777  
Year of Publication: 2001
ISBN:0-7695-0993-2
Authors
C. Yeung  VSI Alliance
P. Clarke
A. Haverinen  Nokia, Finland
G. Matthews  ST Microelectronics, France
J. Morris  ARM, UK
J. Zaidi  Palmchip Corp.
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
ECSI :
IEEE-CS\DATC : IEEE Computer Society
RAS : RAS
EDAC : Electronic Design Automation Consortium
IEEE-CS\TTTC : Test Technology Technical Council
IFIP WG 10.5 : IFIP WG 10.5
EDAA : European Design Automation Association
Publisher
IEEE Press  Piscataway, NJ, USA
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G. Matthews: colleagues
J. Morris: colleagues
J. Zaidi: colleagues