Model and analysis for combined package and on-chip power grid simulation

ABSTRACT

We present new modeling and simulation techniques to improve the accuracy and efficiency of transient analysis of large power disðtribution grids. These include an accurate model for the inherent decoupling capacitance of non-switching devices, as well as a staðtistical switching current model for the switching devices. Moreðover, three new simulation techniques are presented for problem size-reduction and speed-up. Results of application of these techðniques on three PowerPCtmmicroprocessors are also presented.

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INDEX TERMS

Primary Classification:
  B. Hardware
  B.7 INTEGRATED CIRCUITS

Additional Classification:
  B. Hardware
  B.6 LOGIC DESIGN

General Terms:
Design, Performance, Theory