| Dual-VT SRAM cells with full-swing single-ended bit line sensing for high-performance on-chip cache in 0.13 μm technology generation |
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International Symposium on Low Power Electronics and Design
archive
Proceedings of the 2000 international symposium on Low power electronics and design
table of contents
Rapallo, Italy
Pages: 15 - 19
Year of Publication: 2000
ISBN:1-58113-190-9
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Authors
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Fatih Hamzaoglu
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Microprocessor Research Labs, Intel Corporation, Hillsboro, OR
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Yibin Te
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Microprocessor Research Labs, Intel Corporation, Hillsboro, OR
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Ali Keshavarzi
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Microprocessor Research Labs, Intel Corporation, Hillsboro, OR
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Kevin Zhang
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Low Power Design Lab, Intel Corporation, Hillsboro, OR
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Siva Narendra
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Microprocessor Research Labs, Intel Corporation, Hillsboro, OR
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Shekhar Borkar
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Microprocessor Research Labs, Intel Corporation, Hillsboro, OR
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Mircea Stan
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Department of ECE, University of Virginia, Charlottesville, VA
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Vivek De
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Microprocessor Research Labs, Intel Corporation, Hillsboro, OR
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| Bibliometrics |
Downloads (6 Weeks): 10, Downloads (12 Months): 51, Citation Count: 13
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ABSTRACT
Comparisons among different dual-VT design choices for a large on-chip cache with single-ended sensing show that the design using a dual-VT cell and low-VT peripheral circuits is the best, and provides 10% performance gain with 1.2x larger active leakage power, and 1.6% larger cell area compared to the best design using high-VT cells.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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CITED BY 13
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Shengqi Yang , Wayne Wolf , Wenping Wang , N. Vijaykrishnan , Yuan Xie, Low-leakage robust SRAM cell design for sub-100nm technologies, Proceedings of the 2005 conference on Asia South Pacific design automation, January 18-21, 2005, Shanghai, China
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Shengqi Yang , Wenping Wang , Tiehan Lu , Wayne Wolf , N. Vijaykrishnan , Yuan Xie, Case study of reliability-aware and low-power design, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, v.16 n.7, p.861-873, July 2008
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