Fast temperature calculation for transient electrothermal simulation by mixed frequency/time domain thermal model reduction

ABSTRACT

In full-c hip elecrothermal analysis, the substrate is usually discretized into a lumped 3-D network to simulate the heat flow, which is computationally inefficient due to the numerous internal nodes represen ting the substrate interior. Y et traditional interconnect model reduction techniques are not v ery effectiv e at handling complex mlti-port networks with large port counts. In this work we overcome this limitation b y applying time-domain approximation techniques such as ARWE and Prony's method to further simplify the reduced substrate thermal netw ork. Experiments show that our method provides highly accurate simulation results with performance improvement in the range of 2x to 5x.

REFERENCES

• 1: Y.-K. Cheng, P. Raha, C.-C. Teng, E. Rosenbaum and S. M. Kang, "ILLIADS-T: An Electrothermal Timing Simulator for Temperature-Sensitive Reliability Diagnosis of CMOS VLSI Chips," IEEE Trans. on CAD, Vol. 17, No. 8, August 1998, pp. 668-681.
• 2: P. Leturcq, J. Dorkel, A. Napieralski, "A New Approach to Thermal Analysis of Power Devices," IEEE Trans. on Electron Devices, vol. 34, no. 5, pp. 1147-1156, 1987.
• 3: K. Fukahori and P. R. Gray, "Computer Simulation of Integrated Circuits in the Presence of Electrothermal Interactions," IEEE J. Solid-State Circuits, vol. SC-11, December 1976, pp. 834-846.
• 4: Mohamed-Nabil Sabry , Anne Bontemps , Veronique Aubert , Reinhold Vahrmann, Realistic and efficient simulation of electro-thermal effects in VLSI circuits, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, v.5 n.3, p.283-289, Sept. 1997 [doi>10.1109/92.609871]
• 5: J. P. Fradin, B. Desaunettes, "Automatic Computation of Conductive Conductances Intervening in the Thermal Chain," 25th International Conference on Environmental Systems, July 1995.
• 6: A. J. Chapman, Heat Transfer, 4th ed. New York, NY: Macmillan Publishing Company, 1984.
• 7: M. N. Ozisik, Boundary Value Problems of Heat Condition. New York, NY:Dover, 1968.
• 8: Kevin J. Kerns , Ivan L. Wemple , Andrew T. Yang, Stable and efficient reduction of substrate model networks using congruence transforms, Proceedings of the 1995 IEEE/ACM international conference on Computer-aided design, p.207-214, November 05-09, 1995, San Jose, California, United States
• 9: K. J. Kerns and A. T. Yang, "Stable and Efficient Reduction of Large, Multiport RC Network by Pole Analysis via Congruence Transformations," IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, Vol. 16, No.7, July 1997, pp. 734-744.
• 10: P. Feldmann , R. W. Freund, Reduced-order modeling of large linear subcircuits via a block Lanczos algorithm, Proceedings of the 32nd ACM/IEEE conference on Design automation, p.474-479, June 12-16, 1995, San Francisco, California, United States [doi>10.1145/217474.217573]
• 11: Altan Odabasioglu , Mustafa Celik , Lawrence T. Pileggi, PRIMA: passive reduced-order interconnect macromodeling algorithm, Proceedings of the 1997 IEEE/ACM international conference on Computer-aided design, p.58-65, November 09-13, 1997, San Jose, California, United States
• 12: Kevin J. Kerns , Andrew T. Yang, Preservation of passivity during RLC network reduction via split congruence transformations, Proceedings of the 34th annual conference on Design automation, p.34-39, June 09-13, 1997, Anaheim, California, United States [doi>10.1145/266021.266031]
• 13: James W. Demmel, Applied numerical linear algebra, Society for Industrial and Applied Mathematics, Philadelphia, PA, 1997
• 14: V. Raghavan , J. E. Bracken , R. A. Rohrer, AWESpice: a general tool for the accurate and efficient simulation of interconnect problems, Proceedings of the 29th ACM/IEEE conference on Design automation, p.87-92, June 08-12, 1992, Anaheim, California, United States
• 15: B. N. Parlett and D. S. Scott, "The Lanczos Algorithm with Selective Orthogonalizatoin," Mathematical Computation, vol. 33, pp. 217-238, Jan. 1979.
• 16: Begnaud Francis Hildebrand, Introduction to numerical analysis: 2nd edition, Dover Publications, Inc., New York, NY, 1987
• 17: Tong Li , Ching-Han Tsai , Sung-Mo Steve Kang, Efficient transient electrothermal simulation of CMOS VLSI circuits under electrical overstress, Proceedings of the 1998 IEEE/ACM international conference on Computer-aided design, p.6-11, November 08-12, 1998, San Jose, California, United States [doi>10.1145/288548.288553]

INDEX TERMS

Primary Classification:
  J. Computer Applications

Additional Classification:
  B. Hardware
  B.4 INPUT/OUTPUT AND DATA COMMUNICATIONS
  B.7 INTEGRATED CIRCUITS
      B.7.2 Design Aids
          Subjects: Simulation
  B.8 Performance and Reliability

  C. Computer Systems Organization
  C.1 PROCESSOR ARCHITECTURES
      C.1.2 Multiple Data Stream Architectures (Multiprocessors)
          Subjects: Interconnection architectures (e.g., common bus, multiport memory, crossbar switch)

  I. Computing Methodologies
  I.6 SIMULATION AND MODELING

General Terms:
Algorithms, Design, Experimentation, Measurement, Performance, Theory