| Self-test methodology for at-speed test of crosstalk in chip interconnects |
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Annual ACM IEEE Design Automation Conference
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Proceedings of the 37th Annual Design Automation Conference
table of contents
Los Angeles, California, United States
Pages: 619 - 624
Year of Publication: 2000
ISBN:1-58113-187-9
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Authors
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Xiaoliang Bai
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Department of ECE, University of California, San Diego
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Sujit Dey
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Department of ECE, University of California, San Diego
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Janusz Rajski
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Mentor Graphics Corporation, Wilsonville, OR
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Downloads (6 Weeks): 3, Downloads (12 Months): 24, Citation Count: 15
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ABSTRACT
The effect of crosstalk errors is most significant in high-performance circuits, mandating at-speed testing for crosstalk defects. This paper describes a self-test methodology that we have developed to enable on-chip at-speed testing of crosstalk defects in System-on-Chip interconnects. The self-test methodology is based on the Maximal Aggressor Fault Model [13], that enables testing of the interconnect with a linear number of test patterns. To enable self-testing of the interconnects, we have designed efficient on-chip test generators and error detectors to be embedded in necessary cores; while the test generators generate test vectors for crosstalk faults, the error detectors analyze the transmission of the test sequences received from the interconnects, and detect any transmission errors. We have also designed test controllers to initiate and manage test transactions by activating the appropriate test generators and error detectors, and having error diagnosis capability. We have developed, simulated, and synthesized parameterized HDL models of the self-test structures. We have applied the self-test methodology to test crosstalk defects in the buses of a DSP chip. Using a new high-level crosstalk simulation technique, we have validated the self-test methodology, including the self-test structures inserted in the DSP chip.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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P. Nordholz , D. Treytnar , J. Otterstedt , H. Grabinski , D. Niggemeyer , T. W. Williams, 2.2 Signal Integrity Problems in Deep Submicron Arising from Interconnects between Cores, Proceedings of the 16th IEEE VLSI Test Symposium, p.28, April 26-30, 1998
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Michael Cuviello , Sujit Dey , Xiaoliang Bai , Yi Zhao, Fault modeling and simulation for crosstalk in system-on-chip interconnects, Proceedings of the 1999 IEEE/ACM international conference on Computer-aided design, p.297-303, November 07-11, 1999, San Jose, California, United States
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CITED BY 15
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A. Krstic , W. C. Lai , K. T. Cheng , L. Chen , S. Dey, Embedded software-based self-testing for SoC design, Proceedings of the 39th conference on Design automation, June 10-14, 2002, New Orleans, Louisiana, USA
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