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Self-test methodology for at-speed test of crosstalk in chip interconnects
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 37th Annual Design Automation Conference table of contents
Los Angeles, California, United States
Pages: 619 - 624  
Year of Publication: 2000
ISBN:1-58113-187-9
Authors
Xiaoliang Bai  Department of ECE, University of California, San Diego
Sujit Dey  Department of ECE, University of California, San Diego
Janusz Rajski  Mentor Graphics Corporation, Wilsonville, OR
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
EDAC : Electronic Design Automation Consortium
IEEE-CAS : Circuits & Systems
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 3,   Downloads (12 Months): 24,   Citation Count: 15
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ABSTRACT

The effect of crosstalk errors is most significant in high-performance circuits, mandating at-speed testing for crosstalk defects. This paper describes a self-test methodology that we have developed to enable on-chip at-speed testing of crosstalk defects in System-on-Chip interconnects. The self-test methodology is based on the Maximal Aggressor Fault Model [13], that enables testing of the interconnect with a linear number of test patterns. To enable self-testing of the interconnects, we have designed efficient on-chip test generators and error detectors to be embedded in necessary cores; while the test generators generate test vectors for crosstalk faults, the error detectors analyze the transmission of the test sequences received from the interconnects, and detect any transmission errors. We have also designed test controllers to initiate and manage test transactions by activating the appropriate test generators and error detectors, and having error diagnosis capability. We have developed, simulated, and synthesized parameterized HDL models of the self-test structures. We have applied the self-test methodology to test crosstalk defects in the buses of a DSP chip. Using a new high-level crosstalk simulation technique, we have validated the self-test methodology, including the self-test structures inserted in the DSP chip.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

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H. Kawaguchi and T. Sakurai, "Delay and Noise Formulas for Capacitively Coupled Distributed RC Lines", Proceedings of the Asian and South Pacific Design Automation Conference, Pages35- 43, 1998.
 
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CITED BY  15

Collaborative Colleagues:
Xiaoliang Bai: colleagues
Sujit Dey: colleagues
Janusz Rajski: colleagues