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High-level simulation of substrate noise generation including power supply noise coupling
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 37th Annual Design Automation Conference table of contents
Los Angeles, California, United States
Pages: 446 - 451  
Year of Publication: 2000
ISBN:1-58113-187-9
Authors
Marc van Heijningen  IMEC v.z.w., Kapeldreef 75, B-3001 Leuven, Belgium
Mustafa Badaroglu  IMEC v.z.w., Kapeldreef 75, B-3001 Leuven, Belgium
Stéphane Donnay  IMEC v.z.w., Kapeldreef 75, B-3001 Leuven, Belgium
Marc Engels  IMEC v.z.w., Kapeldreef 75, B-3001 Leuven, Belgium
Ivo Bolsens  IMEC v.z.w., Kapeldreef 75, B-3001 Leuven, Belgium
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
EDAC : Electronic Design Automation Consortium
IEEE-CAS : Circuits & Systems
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 15,   Downloads (12 Months): 45,   Citation Count: 12
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ABSTRACT

Substrate noise caused by large digital circuits will degrade the performance of analog circuits located on the same substrate. To simulate this performance degradation, the total amount of generated substrate noise must be known. Simulating substrate noise generated by large digital circuits is however not feasible with existing circuit simulators and detailed substrate models due to the long simulation times and high memory requirements. We have developed a methodology to simulate this substrate noise generation at a higher level. Not only does this methodology take noise coupling from switching gates into account, but also noise coupling from the power supply is included. This paper describes this simulation methodology. In the paper it is shown that the high-level simulations correspond very well with SPICE simulations and that a large gain in simulation speed is obtained. This high-level simulation methodology makes it possible to predict substrate noise generation of large digital circuits in a very efficient way, early in the design flow of mixed-signal ASICs.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
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2
N. K. Verghese and D. J. Allstot, "Verification of RF and mixed-signal integrated circuits for substrate coupling effects," in Proc. 1997 IEEE Custom Integrated Circuits Conf., pp. 363-370, 1997.
 
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6
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7
J. Briaire and K. Krisch, "Substrate Injection and Crosstalk in CMOS Circuits," in Proc. 1999 IEEE Custom Integrated Circuits Conf., pp. 483-486, 1999.
 
8
M. van Heijningen, J. Compiet, E Wambacq, S. Donnay, M. Engels, and I. Bolsens, "Modeling of Digital Substrate Noise Generation and Experimental Verification Using a Novel Substrate Noise Sensor," in Proceedings of the ESSCIRC, pp. 186-189, 1999.
 
9
T. Blalack, J. Lau, F. J. R. Cldment, and B. A. Wooley, "Experimental Results and Modeling of Noise Coupling in a Lightly Doped Substrate," in IEDM' 96 Tech. Dig., pp. 623-626, Dec. 1996.
 
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W. Liu, R. Gharpurey, M. C. Chang, U. Erdogan, R. Aggarwal, and J. E Mattia, "R.F. MOSFET Modeling Accounting for Distributed Substrate and Channel Resistances with Emphasis on the BSIM3v3 SPICE Model," in Technical Digest of the IEEE International Electron Devices Meeting, pp. 309- 312, 1997.
 
11
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12
Layin of Snaketech, http://www.snaketech.com.
 
13

CITED BY  12

Collaborative Colleagues:
Marc van Heijningen: colleagues
Mustafa Badaroglu: colleagues
Stéphane Donnay: colleagues
Marc Engels: colleagues
Ivo Bolsens: colleagues