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Impact of interconnect variations on the clock skew of a gigahertz microprocessor
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 37th Annual Design Automation Conference table of contents
Los Angeles, California, United States
Pages: 168 - 171  
Year of Publication: 2000
ISBN:1-58113-187-9
Authors
Ying Liu  Department of Electrical and Computer Engineering, Carnegie Mellon University, 5000 Forbes Ave., Pittsburgh, PA
Sani R. Nassif  IBM Austin Research Lab, 11400 Burnet Road, Austin, TX
Lawrence T. Pileggi  Department of Electrical and Computer Engineering, Carnegie Mellon University, 5000 Forbes Ave., Pittsburgh, PA
Andrzej J. Strojwas  Department of Electrical and Computer Engineering, Carnegie Mellon University, 5000 Forbes Ave., Pittsburgh, PA
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
EDAC : Electronic Design Automation Consortium
IEEE-CAS : Circuits & Systems
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 4,   Downloads (12 Months): 56,   Citation Count: 30
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ABSTRACT

Due to the large die sizes and tight relative clock skew margins, the impact of interconnect manufacturing variations on the clock skew in today's gigahertz microprocessors can no longer be ignored. Unlike manufacturing variations in the devices, the impact of the interconnect manufacturing variations on IC timing performance cannot be captured by worst/best case corner point methods. Thus it is difficult to estimate the clock skew variability due to interconnect variations. In this paper we analyze the timing impact of several key statistically independent interconnect variations in a context-dependent manner by applying a previously reported interconnect variational order-reduction technique. The results show that the interconnect variations can cause up to 25% clock skew variability in a modern microprocessor design.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
Boning, D.S. and J.E. Chung, "Statistical metrology - measurement and modeling of variation for advanced process development and design rule generation", Proc. 1998 Int. Conf. on Characterization. and Metrology for ULSI Technology, March 1998.
 
2
Hofstee, E el al, "A 1 GHz single-issue 64b PowerPC processor", Technical digest of lEEE Intl. Solid-State Circuit Conference(ISSCC), 2000.
3
 
4
Mehrotra, V., S. Nassif, D. Boning and J. Chung, "Modeling the effects of manufacturing variation on high-speed microprocessor interconnect performance", Proc. IEDM, 1998.
5
 
6
Sakurai, T. and K. Tamaru, "Simple formulas for two- and three-dimensional capacitances", IEEE Trans. Electron Devices, vol. ED-30, February 1983.
 
7
Stine, B.E. et al, "The physical and electrical effects of metal fill patterning practices for oxide chemical mechanical polishing processes", IEEE Tran. Electron Devices, vol. 45, No. 3, March 1998.

CITED BY  30

Collaborative Colleagues:
Ying Liu: colleagues
Sani R. Nassif: colleagues
Lawrence T. Pileggi: colleagues
Andrzej J. Strojwas: colleagues