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Test challenges for deep sub-micron technologies
Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 37th Annual Design Automation Conference table of contents
Los Angeles, California, United States
Pages: 142 - 149  
Year of Publication: 2000
ISBN:1-58113-187-9
Authors
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
EDAC : Electronic Design Automation Consortium
IEEE-CAS : Circuits & Systems
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): n/a,   Downloads (12 Months): n/a,   Citation Count: 14
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abstract   cited by   index terms   collaborative colleagues  

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ABSTRACT

The use of deep submicron process technologies presents several new challenges in the area of manufacturing test. While a significant body of work has been devoted to identifying and investigating design challenges in nanometer technologies, the impact on test strategies and methodologies is still not well understood. This paper highlights the challenges to current test methodologies arising from technology driven trends, and will present an overview of emerging techniques that address deep submicron test challenges.


CITED BY  14

Collaborative Colleagues:
Kwang-Ting Chueng: colleagues
Sujit Dey: colleagues
Mike Rodgers: colleagues
Kaushik Roy: colleagues