| Towards a new standard for system-level design |
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International Conference on Hardware Software Codesign
archive
Proceedings of the eighth international workshop on Hardware/software codesign
table of contents
San Diego, California, United States
Pages: 2 - 6
Year of Publication: 2000
ISBN:1-58113-268-9
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Downloads (6 Weeks): 5, Downloads (12 Months): 20, Citation Count: 3
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ABSTRACT
Huge new design challenges for system-on-chip (SoC) are the result of decreasing time-to-market coupled with rapidly increasing gate counts and embedded software representing 50-90 percent of the functionality. The exchange of system-level intellectual property (IP) models for creating executable specifications has become a key strategic element for efficient system-to-silicon design flows. Because C and C++ are the dominant languages used by chip architects, systems engineers and software engineers today, we believe that a C-based approach to hardware modeling is necessary. This will enable co-design, providing a more natural solution to partitioning functionality between hardware and software. In this paper we present the design of SystemC, a C++ class library that provides the necessary features for modeling design hierarchy, concurrency, and reactivity in hardware. We will also describe experiences of using SystemC 1) for the co-verification of 8051 processor with a bus-functional model and 2) for the modeling and simulation of an MPEG-2 video decoder.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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Open SystemC Initiative. See http://www, systemc, org.
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CITED BY 3
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Girish Venkataramani , Tiberiu Chelcea , Seth Copen Goldstein , Tobias Bjerregaard, SOMA: a tool for synthesizing and optimizing memory accesses in ASICs, Proceedings of the 3rd IEEE/ACM/IFIP international conference on Hardware/software codesign and system synthesis, September 19-21, 2005, Jersey City, NJ, USA
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M. Niedermayer , S. Guttowski , R. Thomasius , D. Polityko , K. Schrank , H. Reichl, Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies, Proceedings of the fifth international conference on Information processing in sensor networks, April 19-21, 2006, Nashville, Tennessee, USA
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