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Multiprocessor-based placement by simulated annealing
Full text PdfPdf (835 KB)
Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 23rd ACM/IEEE Design Automation Conference table of contents
Las Vegas, Nevada, United States
Pages: 567 - 573  
Year of Publication: 1986
ISBN:0-8186-0702-5
Authors
Saul A. Kravitz  Department of Electrical and Computer Engineering, Carnegie-Mellon University, Pittsburgh, PA
Rob A. Rutenbar  Department of Electrical and Computer Engineering, Carnegie-Mellon University, Pittsburgh, PA
Sponsor
SIGDA: ACM Special Interest Group on Design Automation
Publisher
IEEE Press  Piscataway, NJ, USA
Bibliometrics
Downloads (6 Weeks): 0,   Downloads (12 Months): 10,   Citation Count: 7
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ABSTRACT

Simulated annealing methods have proven to be particularly successful in physical design applications, but often require burdensome, long run times. This paper studies the design and analysis of standard cell placement by annealing in a multiprocessor environment. Annealing is not static: we observe that the temperature parameter which controls hill-climbing in simulated annealing changes the behavior of an annealing algorithm as it runs, and strongly influences the choice of multiprocessor partitioning strategy. We introduce the idea of adaptive strategies that exhibit different speedups across different temperature ranges. Measured performance of parallel placement algorithms running on a multiprocessor demonstrate practical speedups consistent with our predictions.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
R. Ba~roa et al., "MACH-I: Aa Operating System Environment for Large-Scale Multiprocessor Applications", IEEE Software, July 1985.
 
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4
S. Kirkpatrick, C.D. Gelatt, M.P. Vecchi, "Optimization by Simulated Annealing", Science, 220(4598):671-680 , May 1983.
 
5
S. Kravitz, "Multiprocessor-Bazed Placement by Simulated Annealing", Research Report CMUCAD-86-6, Dept. of ECE, Carnegie-Mellon University, February 1986.
 
6
C. Sechea, A. Sangiovaani Vineentelli, "The Timberwolf Placement and Routing Package", IEEE Journal of Solid-State Circuits, SC-20(2):510-522, April 1985.
 
7
R. Smith, "Accelerator Plans for Iterative Improvement Placement", Presentation at IEEE Physical Design Workshop, January 1985.
8
 
9
K. Ueda, T. Komatsubara, and T. Hosaka, "A Parallel Processing Approach for Logic Module Placement", IEEE Trans. on CAD, CAD-2(1):39-47 , January 1983.

CITED BY  7

Collaborative Colleagues:
Saul A. Kravitz: colleagues
Rob A. Rutenbar: colleagues