Analysis of timing failures due to random AC defects in VLSI modules

ABSTRACT

This paper presents an analytical model for projecting the yield loss due to random delay defects for modules or VLSI packages containing multiple semiconductor chips. A module to be analyzed is characterized by distribution of path delays. Statistical analysis is applied to obtain the distribution of delays caused by defects in logic circuits of LSI chips. The model uses these two distributions to calculate the probability that a module contains a path that does not meet the system timing requirements. All inputs to the model can be obtained much earlier than the availability of modules for actual testing. Therefore expected module yield loss due to delay defects can be projected before the modules are actually manufactured.

REFERENCES

• 1: Robert Hitcho:k,Sz., Gozdon L. Smith, and David D. Cheng, "Timing Analysi= of Computer Hardware," IBM J. Res. Develop. 26,100-105, January 1982.
• 2: E. R. Hsieh , R. A. Rasmussen , L. J. Vidunas , W. T. Davis, Delay test generation, Proceedings of the 14th conference on Design automation, p.486-491, January 1977
• 3: Donald S. Cleveziey, "The Role of Testing In Achieving Zero Defects," Proceedings of the 1982 liCE International Test Conference, November 1982, pp. 248-253.
• 4: K. E. Torku , C. E. Radke, Quality level and fault coverage for multichip modules, Proceedings of the 20th conference on Design automation, p.201-206, June 27-29, 1983, Miami Beach, Florida, United States
• 5: C. C. Beh, K. H. Azya, C. E. Radke, and K. ~. Torku, "Do Stuck Fault Models Reflect Manufacturing Defects?," Pzoceeeding= of the 1982 IEEE International Test Conference, pp. $5--~2.
• 6: D. B. Owen, "Handbook of Statistical Tables," Addison-Wesley, Reading,Mass., 1962, pp.,l-10.
• 7: APL Statistical Libzazy, Fozm No. 5H20-184.1, IBM Corporation, Nhite Plains, N.Y., 1976, pp. 60-61.

INDEX TERMS

Primary Classification:
  B. Hardware
  B.7 INTEGRATED CIRCUITS
      B.7.1 Types and Design Styles
          Subjects: VLSI (very large scale integration)

Additional Classification:
  B. Hardware
  B.7 INTEGRATED CIRCUITS
      B.7.2 Design Aids
          Subjects: Simulation
  B.8 Performance and Reliability

  C. Computer Systems Organization
  C.4 PERFORMANCE OF SYSTEMS
      Subjects: Modeling techniques

  J. Computer Applications

General Terms:
Design, Measurement, Performance, Reliability, Theory