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Interconnect estimation and planning for deep submicron designs
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 36th annual ACM/IEEE Design Automation Conference table of contents
New Orleans, Louisiana, United States
Pages: 507 - 510  
Year of Publication: 1999
ISBN:1-58133-109-7
Authors
Jason Cong  Department of Computer Science, University of California, Los Angeles, CA
David Zhigang Pan  Department of Computer Science, University of California, Los Angeles, CA
Sponsors
EDAC : Electronic Design Automation Consortium
IEEE-CAS : Circuits & Systems
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 4,   Downloads (12 Months): 16,   Citation Count: 14
Additional Information:

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REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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J. Gong and D. Z. Pan, "Interconnect delay estimation models for synthesis and design planning," in Proc. Asia and South Pacific Design Automation Conf., pp. 97-100, Jan., 1999.
 
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J. Cong and D. Z. Pan, "Interconnect estimation and planning for deep submicron designs," Tech. Rep. 980035, UCLA CS Dept, 1998. http://cadlab.cs.ucla.edu/~,,pan/publications/.
 
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Semiconductor Industry Association, National Technology Roadmap for Semiconductors, 1997.
 
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J. Davis and ,}. Meindl, "Is interconnect the weak link?," IEEE Circuits and Devices Magazine, vol. 14, no. 2, pp. 30-36, 1998.
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P. Fisher and R. Nesbitt, "The test of time. clock-cycle estimation and test challenges for future microprocessors," IEEE Circuits and Devices Magazine, vol. 14, pp. 37-44, March 1998.
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W. C. Elmore, "The transient response of damped linear networks with particular regard to wide-band amplifiers," Journal of Applied Physics, vol. 19, pp. 55-63, Jan. 1948.
 
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J. Davis, V. De, and J. Meindl, "A stochastic wire-length distribution for gigascale integration (GSI) i. derivation and validation," IEEE Transactions on Electron Devices, vol. 45, no. 3, pp. 580-9, 1998.

CITED BY  14

Collaborative Colleagues:
Jason Cong: colleagues
David Zhigang Pan: colleagues