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Getting to the bottom of deep submicron II: a global wiring paradigm
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Source International Symposium on Physical Design archive
Proceedings of the 1999 international symposium on Physical design table of contents
Monterey, California, United States
Pages: 193 - 200  
Year of Publication: 1999
ISBN:1-58113-089-9
Authors
Dennis Sylvester  University of California, Berkeley, Department of Electrical Engineering and Computer Sciences
Kurt Keutzer  University of California, Berkeley, Department of Electrical Engineering and Computer Sciences
Sponsor
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 12,   Downloads (12 Months): 41,   Citation Count: 24
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REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

1
 
2
National Technology Roadmap for Semiconductors, Semiconductor Industry Association, 1997.
 
3
M. Bohr et al., "A High Performance 0.25 ttm Logic Technology Optimized for 1.SV Operation," Proc. oflEDM, pp. 847-50, 1996.
4
 
5
H.B. Bakoglu, Circuits, Interconnections, and Packaging for VLSI, Addison-Wesley, 1990.
 
6
G.A. Sai-Halasz, "Performance Trends in High-End Processors," Proc. of IEEE, pp. 20- 36, Jan. 1995.
 
7
N. Vasseghi, K. Yeager, E. Sarto, and M. Seddighnezhad, "200- MHz Superscalar RISC Microprocessor," IEEE Journal of Solid-State Circuits, vol. 31, pp. 1675-1685, Nov. 1996.
 
8
P. Zarkesh-Ha and J.D. Meindl, "Stochastic net length distributions for global interconnects in a heterogeneous system-on-achip," Proc. of VLSI Symposium on Tech., pp. 44--5, 1998.
 
9
D. Sylvester, C. Hu, O.S. Nakagawa, and S.Y. Oh, "interconnect Scaling: Signal Integrity and Performance in Future High-Speed CMOS Designs," Proc. of VLSI Symposium on Tech., pp. 42-3, 1998.
 
10
W.E. Donath, "Placement and average interconnection lengths of computer logic," IEEE Trans. on Circuits and Systems, v. 26, pp. 272- 277, Apr. 1979.
 
11
S-Y. Kim, N. Gopal, and L. Pillegi, "Time-Domain Macromodels for VLSI Interconnect Analysis," IEEE Trans. on CAD, v. 13, pp. 1257-1270, Oct. 1994.
12
13
 
14
 
15
T. Sakurai, "Closed-form expressions for interconnection delay, coupling, and crosstalk in VLSrs," IEEE Trans. on Electron Devices, v. 40, pp. 118-124, Jan. 1993.
 
16
Q. Zhn and S. Tam, "Package Clock Distribution Design Optimization for High-Speed and Low-Power VLSI's," IEEE Trans. Comp, Pack, and Manuf Tech., v. 20, pp. 56-63, Feb. 1997.
 
17
R.R. Tummala and E. Rymaszewski, Microelecrronics Packaging Handbook, Van Nostrand Reinhold, New York, 1989.
 
18
O.S. Nakagawa, D. Sylvester, J.G. McBride, and S-Y. Oh, "Closed-form modeling of on-chip crosstalk noise in deep submicron ULSI interconnect," lip Journal, pp. 39-45, Aug 1998.
 
19
W.S. Song and L.A. Glasser, "Power Distribution Techniques for VLSI Circuits," IEEE Journal of Solid-State Circuits, v. 21, pp. 150- 156, Feb. 1986.

CITED BY  24

Collaborative Colleagues:
Dennis Sylvester: colleagues
Kurt Keutzer: colleagues