Interconnect thermal modeling for determining design limits on current density

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Interconnect thermal modeling for determining design limits on current density

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International Symposium on Physical Design archive
Proceedings of the 1999 international symposium on Physical design table of contents

Monterey, California, United States

Pages: 172 - 178

Year of Publication: 1999

ISBN:1-58113-089-9

Authors

Danqing Chen	Department of Electrical and Computer Engineering, Coordinated Science Laboratory, University of Illinois at Urbana-Champaign
Erhong Li	Department of Electrical and Computer Engineering, Coordinated Science Laboratory, University of Illinois at Urbana-Champaign
Elyse Rosenbaum	Department of Electrical and Computer Engineering, Coordinated Science Laboratory, University of Illinois at Urbana-Champaign
Sung-Mo (Steve) Kang	Department of Electrical and Computer Engineering, Coordinated Science Laboratory, University of Illinois at Urbana-Champaign

Sponsor

SIGDA: ACM Special Interest Group on Design Automation

Publisher

ACM New York, NY, USA

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Downloads (6 Weeks): 7, Downloads (12 Months): 22, Citation Count: 0

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REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

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