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Interconnect coupling noise in CMOS VLSI circuits
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Source International Symposium on Physical Design archive
Proceedings of the 1999 international symposium on Physical design table of contents
Monterey, California, United States
Pages: 48 - 53  
Year of Publication: 1999
ISBN:1-58113-089-9
Authors
Kevin T. Tang  Department of Electrical and Computer Engineering, University of Rochester, Rochester, New York
Eby G. Friedman  Department of Electrical and Computer Engineering, University of Rochester, Rochester, New York
Sponsor
SIGDA: ACM Special Interest Group on Design Automation
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 7,   Downloads (12 Months): 42,   Citation Count: 10
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REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
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2
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3
S. Voranantakul, J. L. Prince, and P. Hsu, "Crosstalk Analysis for High-Speed Pulse Propagation in Lossy Electrical Interconnections," {BEE Transactions on Components, Hybrid.s, and ManuFacturing Technology, Vol. 16, No. 1, pp. 127-136, February 1993.
 
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5
A. Deutsch, et al., "When are Transmission-Line Effects Important for On-Chip lnterconnectionsT" IEEE Transactio~ on Microwave Theory and Techniques, Vol. 45, No. 10, pp. 1836-1846, October. 1997.
 
6
M. Shoji, Theory of CMOS Digital Circuits and Circuit Failures, Princeton University Press, Princeton, New Jersey, 1992.
 
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8
T. Sakurai, "Closed-Form Expression for Interconnection Delay, Coupling, and Crosstalk in VLSI's,~ IEEE Transactior~ on Electron Devices, Vol. 40, No. 1, pp. 118-124, January 1993.
 
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10
Y. Yang and J. R. Brews, "Crosstalk F~tim&te for CMOS- Terminated RLC interconnect,n IEEE Tr,~nsactlons on Circuits and Systems I: Fundamental Theory and Application, Vol. 44, No. 1, pp. 82-85, January 1997.
 
11
A. R. Djordjevi<~, T. K. Sarkar, and R. F. Haxrington, "Time- Domain Response of Multiconductor Transmission Lines,~ Proceedings of the IEEE, Vol. 75, No. 6, pp. 743-764, June 1987.
 
12
T. V. Dish, B. Cabon, and j. Chilo, "SPICE Simulation of Lossy and Coupled Interconneetion Lines," IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part B, Vol. 17, No. 2, pp. 134-146, May 1994.
 
13
C. S. Chang, (3. Crowder, and M. McAllister, "Crosstalk in Multilayer Ceramic Packaging,~ Proceedings of the IEEE International Symposium on Circuits and Systems, Vol. 2, pp. 6-11, April 1981.
14
 
15
S. Wong, P. S. Liu, J. Ru, and S. Lin, ~{nterconnect Capacitance Models for VLSI Circuits," Solid-State Electronics, Vol. 42, No. 6, pp. 969-977, June 1998.
 
16
R. E. Matick, T~'ansmission Lines .for Digital and Communication Networks, McGraw-Hill Book Company, 1969.
 
17
F. Moll, M. Roca, and A. Rubio, "Inductance in VLSI Interconnection Modeling," IEE Proceedings-Circuits De~iceJ Sfistefltll, Vol. 145, No. 3, pp. 176-179, June 1998.
 
18
D.A. Priore, "Inductance on Silicon for Sub-Micron CMOS VLSI,w Proceedings of the IEEE Symposium on VLSI Circuits, pp. 17-18, May 1993.
 
19
G. A. Katopis and H. H. Smith, "Coupled Noise Predictors for Lossy interconnects," IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part B, Vol. 17, No. 4, pp. 520-524, November 1994.
 
20
N. Delorme, M.Belleville, a~d J. Chilo, "Inductance and Capacitance Formulas for VLSI Interconnects," lEE ElectronicJ Letter, Vol. 32, pp. 996-997, May 1996.

CITED BY  10

Collaborative Colleagues:
Kevin T. Tang: colleagues
Eby G. Friedman: colleagues