The deep sub-micron signal integrity challenge

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The deep sub-micron signal integrity challenge

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International Symposium on Physical Design archive
Proceedings of the 1999 international symposium on Physical design table of contents

Monterey, California, United States

Pages: 4 - 7

Year of Publication: 1999

ISBN:1-58113-089-9

Author

Desmond A. Kirkpatrick

Intel Corporation, 2501 NW 229th Avenue, Hillsboro OR

Sponsor

SIGDA: ACM Special Interest Group on Design Automation

Publisher

ACM New York, NY, USA

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Downloads (6 Weeks): 7, Downloads (12 Months): 16, Citation Count: 0

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REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

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