| Full-chip verification of UDSM designs |
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International Conference on Computer Aided Design
archive
Proceedings of the 1998 IEEE/ACM international conference on Computer-aided design
table of contents
San Jose, California, United States
Pages: 453 - 460
Year of Publication: 1998
ISBN:1-58113-008-2
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Authors
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R. Saleh
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Simplex Solutions, 521 Almanor Avenue, Sunnyvale, CA
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D. Overhauser
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Simplex Solutions, 521 Almanor Avenue, Sunnyvale, CA
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S. Taylor
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CMOS Solutions, HC1 , BOX 238, Olga, WA
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| Bibliometrics |
Downloads (6 Weeks): 5, Downloads (12 Months): 9, Citation Count: 8
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REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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Arora, N., Raol, K., Schumann, R., and Richardson, L. Modeling and Extraction of Interconnect Capacitances for Multilayer VLSI Circuits, IEEE Transactions on Computer-Aided Design of IC's and Systems, pp. 58- 67, Jan. 1996.
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Black, J.R. Electromigration Failure Modes in Aluminum Metalization for Semiconductor Devices. Proceedings of IEEE, 57, p. 1587, 1969.
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Liew, B.-K., Feng, P., Cheung, N.W., and Hu, C. Circuit reliability simulator for interconnect, via, and contact electromigration, IEEE Tr. Electron Devices, vol. 39, no. 11, pp. 2472, 1992.
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Yong Je Lim , Kyung-Im Son , Heung-Joon Park , Mani Soma, A statistical approach to the estimation of delay-dependent switching activities in CMOS combinational circuits, Proceedings of the 33rd annual conference on Design automation, p.445-450, June 03-07, 1996, Las Vegas, Nevada, United States
[doi> 10.1145/240518.240603]
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Maiz, J.A. Characterization of Electromigration under Bidirectional (BX) and Pulsed Unidirectional (PDC) Currents. In Proceedings of 272 Annual International Reliability Physics Symposium, IEEE, 1989, pp.220- 228.
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Nagaraj NS , Frank Cano , Haldun Haznedar , Duane Young, A practical approach to static signal electromigration analysis, Proceedings of the 35th annual conference on Design automation, p.572-577, June 15-19, 1998, San Francisco, California, United States
[doi> 10.1145/277044.277195]
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Overhauser, D., Lloyd, J.R., Rochel, S., Steele, G., and Hussain, S.Z. Full-Chip Reliability Analysis. In European Symposium on Reliability of Electron Devices Failure Physics and Analysis. October 1998.
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Semiconductor Industry Association (SIA), The National Technology Roadmap for Semiconductors, 1997.
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Towner, J.M. and van de Ven, E. Aluminum Electromigration Under Pulsed DC Conditions. In Proe. 21st Annual IRPS, pp. 36, 1983.
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Chi-Ying Tsui , Radu Marculescu , Diana Marculescu , Massoud Pedram, Improving the efficiency of power simulators by input vector compaction, Proceedings of the 33rd annual conference on Design automation, p.165-168, June 03-07, 1996, Las Vegas, Nevada, United States
[doi> 10.1145/240518.240549]
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Zhang, X. Coupling effects on Wire Delay, Circuit and Devices Magazine, pp. 12-18, Nov. 1996.
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CITED BY 8
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Muzhou Shao , D. F. Wong , Youxin Gao , Li-Pen Yuan , Huijing Cao, Shaping interconnect for uniform current density, Proceedings of the 2002 IEEE/ACM international conference on Computer-aided design, p.254-259, November 10-14, 2002, San Jose, California
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