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Full-chip verification of UDSM designs
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Proceedings of the 1998 IEEE/ACM international conference on Computer-aided design table of contents
San Jose, California, United States
Pages: 453 - 460  
Year of Publication: 1998
ISBN:1-58113-008-2
Authors
R. Saleh  Simplex Solutions, 521 Almanor Avenue, Sunnyvale, CA
D. Overhauser  Simplex Solutions, 521 Almanor Avenue, Sunnyvale, CA
S. Taylor  CMOS Solutions, HC1 , BOX 238, Olga, WA
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
IEEE-CS : Computer Society
IEEE-EDS : Electronic Devices Society
IEEE-CAS : Circuits & Systems
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 5,   Downloads (12 Months): 9,   Citation Count: 8
Additional Information:

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REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
1
Arora, N., Raol, K., Schumann, R., and Richardson, L. Modeling and Extraction of Interconnect Capacitances for Multilayer VLSI Circuits, IEEE Transactions on Computer-Aided Design of IC's and Systems, pp. 58- 67, Jan. 1996.
 
2
Black, J.R. Electromigration Failure Modes in Aluminum Metalization for Semiconductor Devices. Proceedings of IEEE, 57, p. 1587, 1969.
 
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Liew, B.-K., Feng, P., Cheung, N.W., and Hu, C. Circuit reliability simulator for interconnect, via, and contact electromigration, IEEE Tr. Electron Devices, vol. 39, no. 11, pp. 2472, 1992.
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Maiz, J.A. Characterization of Electromigration under Bidirectional (BX) and Pulsed Unidirectional (PDC) Currents. In Proceedings of 272 Annual International Reliability Physics Symposium, IEEE, 1989, pp.220- 228.
 
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Overhauser, D., Lloyd, J.R., Rochel, S., Steele, G., and Hussain, S.Z. Full-Chip Reliability Analysis. In European Symposium on Reliability of Electron Devices Failure Physics and Analysis. October 1998.
 
14
Semiconductor Industry Association (SIA), The National Technology Roadmap for Semiconductors, 1997.
 
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Towner, J.M. and van de Ven, E. Aluminum Electromigration Under Pulsed DC Conditions. In Proe. 21st Annual IRPS, pp. 36, 1983.
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18
Zhang, X. Coupling effects on Wire Delay, Circuit and Devices Magazine, pp. 12-18, Nov. 1996.

CITED BY  8

Collaborative Colleagues:
R. Saleh: colleagues
D. Overhauser: colleagues
S. Taylor: colleagues