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Static compaction using overlapped restoration and segment pruning
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Source International Conference on Computer Aided Design archive
Proceedings of the 1998 IEEE/ACM international conference on Computer-aided design table of contents
San Jose, California, United States
Pages: 140 - 146  
Year of Publication: 1998
ISBN:1-58113-008-2
Authors
Surendra K. Bommu  Computers & Communications Research Labs, NEC, Inc., Princeton, NJ
Srimat T. Chakradhar  Computers & Communications Research Labs, NEC, Inc., Princeton, NJ
Kiran B. Doreswamy  Computers & Communications Research Labs, NEC, Inc., Princeton, NJ
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
IEEE-CS : Computer Society
IEEE-EDS : Electronic Devices Society
IEEE-CAS : Circuits & Systems
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 2,   Downloads (12 Months): 4,   Citation Count: 8
Additional Information:

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REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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T. M. Niermann, R. K. Roy, J. H. Patel, and J. A. Abraham, "Test compaction for sequential circuits" IEEE Trans. on CAD, vol. 11, no. 2, pp. 260-267, Feb. 1992.
 
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S.T. Chakradhar and A. Raghunathan, "Bottleneck removal algorithm for dynamic compaction in sequential circuits;' IEEE Trans. on CAD, (Accepted for publication) 1997.
 
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E Brglez, D. Bryan, and K. Kozminski, "Combinational profiles of sequential benchmark circuits," int. Symposium on Circuits and Systems, pp. 1929-1934, May 1989.
 
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CITED BY  8

Collaborative Colleagues:
Surendra K. Bommu: colleagues
Srimat T. Chakradhar: colleagues
Kiran B. Doreswamy: colleagues