Efficient transient electrothermal simulation of CMOS VLSI circuits under electrical overstress

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Efficient transient electrothermal simulation of CMOS VLSI circuits under electrical overstress

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International Conference on Computer Aided Design archive
Proceedings of the 1998 IEEE/ACM international conference on Computer-aided design table of contents

San Jose, California, United States

Pages: 6 - 11

Year of Publication: 1998

ISBN:1-58113-008-2

Authors

Tong Li	Analysis Product Division, Avant! Corporation
Ching-Han Tsai	Dept. of Electrical and Computer Engineering, Univ. of Illinois at Urbana-Champaign
Sung-Mo Steve Kang	Dept. of Electrical and Computer Engineering, Univ. of Illinois at Urbana-Champaign

Sponsors

SIGDA: ACM Special Interest Group on Design Automation
IEEE-CS : Computer Society
IEEE-EDS : Electronic Devices Society
IEEE-CAS : Circuits & Systems

Publisher

ACM New York, NY, USA

Bibliometrics

Downloads (6 Weeks): 5, Downloads (12 Months): 20, Citation Count: 2

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REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

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CITED BY 2

	Ching-Han Tsai , Sung-Mo Kang, Fast temperature calculation for transient electrothermal simulation by mixed frequency/time domain thermal model reduction, Proceedings of the 37th conference on Design automation, p.750-755, June 05-09, 2000, Los Angeles, California, United States
	M. Rencz , V. Szekely , A. Poppe, A Fast Algorithm for the Layout Based Electro-Thermal Simulation, Proceedings of the conference on Design, Automation and Test in Europe, p.11032, March 03-07, 2003