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Performance driven multi-layer general area routing for PCB/MCM designs
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 35th annual Design Automation Conference table of contents
San Francisco, California, United States
Pages: 356 - 361  
Year of Publication: 1998
ISBN:0-89791-964-5
Authors
Jason Cong  UCLA Computer Science Department, Los Angeles, California
Patrick H. Madden  UCLA Computer Science Department, Los Angeles, California
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
EDAC : Electronic Design Automation Consortium
IEEE-CS : Computer Society
Publisher
ACM  New York, NY, USA
Bibliometrics
Downloads (6 Weeks): 2,   Downloads (12 Months): 14,   Citation Count: 14
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ABSTRACT

In this paper we present a new global router appropriate for Multichip Module (MCM) and dense Printed Circuit Board (PCB) design, which utilizes a hybrid of the classical rip-up and reroute approach, and the more recent iterative deletion [9] method. The global router addresses performance issues by utilizing recent results in high performance interconnect design, while still effectively minimizing global congestion. With experimen ts on the maze-routing component of our global router, we show that the choice of routing cost functions can have a significant impact on final solution quality. The results of a number of previously proposed routers may be improved dramatically by adopting the cost functions we suggest here. W e also find little evidence of the “net ordering problem” when our cost functions and routing model are applied. The iterative deletion method is shown to improve global solution quality, particularly when high performance interconnect is required. We evaluate the performance of our global router by comparing the congestion of routes produced by our global router to those of a well known MCM router, V4R [14]. Our global router, MINOTAUR, supports arbitrary numbers of routing layers, differing capacities for each layer, pre-existing congestion and obstacles, and high performance interconnect structures (including those which require variable width interconnect).


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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H. B. Bakoglu. Circuits, Interconnections, and Packaging for VLSI. Addison-Wesley, 1990.
 
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J. D. Cho, K.-F. Liao, S. Raje, and M. Sarrafzadeh. M2R~ Multilayer routing algorithm for high-performance MCMs. IEEE Trans. on Circuits and Systems, 41(4):253-265, April 1994.
 
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J. Cong and P. H. Madden. Performance driven multi-layer general area routing for pcb/mcm designs,. Technical Report 980013, UCLA C$ Dept, March 1998.
 
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J. Cong and B. Preas. A new algorithm for standard cell global routing. In Proc. Int. Conf. on Computer Aided Design, pages 176-179, November 1988.
 
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K.-Y. Khoo and J. Cong. A fast multilayer general area router for MCM designs. IEEE Trans. on Circuits and Systems, pages 841-851, 1992.
 
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K.-Y. Khoo and J. Cong. An efficient multilayer MCM router based on four-via routing. IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, pages 1277-1290, 1994.
 
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C. Y. Lee. An algorithm for path connection and its applications. IRE Trans. on Electronic Computers, EC-10(3):346-365, 1961.
 
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H. Shin and A. Sangiovanni-Vincentelli. A detailed router based on incremental routing modifications: Mighty. IEEE Trans. on Computer-Aided Design of Integrated Circuits and Systems, CAD-6(6):942-955, November 1987.
 
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CITED BY  14

Collaborative Colleagues:
Jason Cong: colleagues
Patrick H. Madden: colleagues