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Multi-pad power/ground network design for uniform distribution of ground bounce
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Source Annual ACM IEEE Design Automation Conference archive
Proceedings of the 35th annual Design Automation Conference table of contents
San Francisco, California, United States
Pages: 287 - 290  
Year of Publication: 1998
ISBN:0-89791-964-5
Authors
Jaewon Oh  Sun Microsystems, Inc., 901 San Antonio Road, MS: USUN03-202, Palo Alto, CA
Massoud Pedram  University of Southern California, Dept. of Electrical Engineering - Systems, Los Angeles, CA
Sponsors
SIGDA: ACM Special Interest Group on Design Automation
EDAC : Electronic Design Automation Consortium
IEEE-CS : Computer Society
Publisher
ACM  New York, NY, USA
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Downloads (6 Weeks): 4,   Downloads (12 Months): 20,   Citation Count: 10
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ABSTRACT

This paper presents a method for power and ground (p/g) network routing for high speed CMOS chips with multiple p/g pads. Our objective is not to reduce the total amount of the ground bounce, but to distribute it more evenly among the pads while the routing area is kept to a minimum. We first show that proper p/g terminal to pad assignment is necessary to reduce the maximum ground bounce and then present a heuristic for performing simultaneous assignment and p/g net routing. Experimental results demonstrate the effectiveness of our method.


REFERENCES

Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.

 
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K.-H. Erhard, F.M. Johannes and R. Dachauer, "Topology Optimization Techniques for Power/Ground Networks in VLSI," Proc. European Design Automation Conference,pp. 362-367, 1992.
 
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Zahir A. Syed and Abbas E1 Gamal, "Single Layer Routing of Power and Ground Networks in Integrated Circuits," Journal of Digital Systems, vol. 6, no. 1, 1982.
 
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S. Chowdhury and Melvin A. Breuer, "Optimum Design of IC Power/Ground Nets Subject to Reliability Constraints," IEEE Transactions on Computer-Aided Design, vol. 7, no. 6, pp. 787-796, July, 1988.
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A. Vaidyanath, B. Thoroddsen, J.L. Prince, "Effect of CMOS Driver Loading Conditions on Simultaneous Switching Noise," IEEE Trans. on Components, Packaging, and Manufacturing Technology-Part B, vol. 17, no, 4,pp.480- 485, Nov. 1994.
 
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Y. Yang, J.R. Brews, "Design Trade-Offs for the Last Stage of an Unregulated, Long-Channel CMOS Off-chip Driver with Simultaneous Switching Noise and Switching Time Consideration," IEEE Trans. on Components, Packaging and Manufacturing Technology- Part B, vol. 19, no. 3, pp. 481- 486, Aug. 1996.
 
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P. Larsson, C. Svensson, "Noise in Digital Dynamic CMOS Circuits," IEEE J. of Solid-State Circuits, vol. 12, no. 6, pp. 655-662, June 1994.
 
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C. K. Cheng and Y.-C. A. Wei, "An Improved Two-way Partitioning Algorithm with Stable Performance," IEEE Trans. on CAD, vol. 10, no 12, pp1502-15 11, Dec. 1991.
 
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See our web site athttp://atrak.usc.edu/~joh

CITED BY  10

Collaborative Colleagues:
Jaewon Oh: colleagues
Massoud Pedram: colleagues