| Efficient thee-dimensional extraction based on static and full-wave layered Green's functions |
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Annual ACM IEEE Design Automation Conference
archive
Proceedings of the 35th annual Design Automation Conference
table of contents
San Francisco, California, United States
Pages: 224 - 229
Year of Publication: 1998
ISBN:0-89791-964-5
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Authors
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Jinsong Zhao
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Department of Computer Engineering, UC Santa Cruz, Santa Cruz, CA
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Wayne W. M. Dai
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Department of Computer Engineering, UC Santa Cruz, Santa Cruz, CA
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Sharad Kapur
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Bell Laboratories, Lucent Technologies, 600 Mountain Avenue, Murray Hill, New Jersey
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David E. Long
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Bell Laboratories, Lucent Technologies, 600 Mountain Avenue, Murray Hill, New Jersey
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Downloads (6 Weeks): 2, Downloads (12 Months): 23, Citation Count: 8
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ABSTRACT
In tegral equation approaches based on layered media Green's functions are often used to extract models of integrated circuit structures. The primary advan tage of these approaches over equiv alen t-sourcebased schemes is the dramatic reduction in problem size. When combined with an SVD-accelerated sc heme for the solution of the associated dense linear system, this leads to a substantial speedup.
In this paper we deriv e and solve for these multila yered 3D Green's functions using a transmission line circuit analog. A generalized image method for an arbitrary number of layers is presen ted. This method is rapidly con vergen t for near-field in teractions. F or the far field, a Chebyshev interpolation approach is adopted, where a database is precomputed (using a Fast Hankel T ransform) and stored. The combination of these tw o approaches leads to an extremely efficient scheme for the generation of Green's functions.
We combine the SVD-accelerated integral equation solver IES3 with the multila yered Green's function approach, apply it to the extraction of IC parasitics and passive components, and we demonstrate its speed, accuracy and versatility via a number of examples.
REFERENCES
Note: OCR errors may be found in this Reference List extracted from the full text article. ACM has opted to expose the complete List rather than only correct and linked references.
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J. Zhao, W. Dai, R. C. Frye, and K. L. Tai. Green function via moment matching for rapid and accurate substrate parasitics evaluation. In Proceedings of the IEEE 1997 Custom Integrated Circuits Conference, Santa Clara, CA, USA, May 1997. New York, NY, USA: IEEE.
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CITED BY 8
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Hongmei Li , Jorge Carballido , Harry H. Yu , Vladimir I. Okhmatovski , Elyse Rosenbaum , Andreas C. Cangellaris, Comprehensive frequency-dependent substrate noise analysis using boundary element methods, Proceedings of the 2002 IEEE/ACM international conference on Computer-aided design, p.2-9, November 10-14, 2002, San Jose, California
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Peter Feldmann , Sharad Kapur , David E. Long, Efficient techniques for modeling chip-level interconnect, substrate and package parasitics, Proceedings of the conference on Design, automation and test in Europe, p.88-es, January 1999, Munich, Germany
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